MPF5302AMMA0ESR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPF5302AMMA0ESR2Last Revision (GMT):
Sunday, 07 July 2024, 10:22:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPF5302AMMA0ESR2SOT2090HWQFN2432.070000 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 533 245182023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Copper Lead-Frame, Pre-Plated AgCopper AlloyCopper and its compoundsCopper, metal7440-50-812.69888895.01600039.597407
Inorganic Silicon compoundsSilicon7440-21-30.0975640.7300000.304224
Iron and its compoundsIron, metal7439-89-60.0169740.1270000.052927
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0040100.0300000.012502
Magnesium and its compoundsMagnesium, metal7439-95-40.0236560.1770000.073764
Manganese and its compoundsManganese, metal7439-96-50.0080190.0600000.025005
Nickel and its compoundsNickel, metal7440-02-00.4316903.2300001.346085
Zinc and its compoundsZinc, metal7440-66-60.0841990.6300000.262549
Subtotal13.365000100.000000041.674462
Silver PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000130.0100000.000042
Silver and its compoundsSilver, metal7440-22-40.13498799.9900000.420912
Subtotal0.135000100.00000000.420954
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.3047502.5000000.950265
Inorganic Silicon compoundsSilica, vitreous60676-86-09.75200080.00000030.408481
Inorganic Silicon compoundsSilicon dioxide7631-86-91.1580509.5000003.611007
Inorganic compoundsCarbon Black1333-86-40.0609500.5000000.190053
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.9142507.5000002.850795
Subtotal12.190000100.000000038.010602
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0003800.0200000.001185
Tin and its compoundsTin, metal7440-31-51.89962099.9800005.923355
Subtotal1.900000100.00000005.924540
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-33.54240498.00000011.045851
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0722942.0000000.225426
Subtotal3.614698100.000000011.271277
Polyimide CoatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0021191.0000000.006609
PolymersPolyimide Resin39355-34-50.20981799.0000000.654247
Subtotal0.211936100.00000000.660856
Redistribution Metal 1Copper and its compoundsCopper, metal7440-50-80.00721779.5374000.022506
Titanium and its compoundsTitanium, metal7440-32-60.00185720.4626000.005790
Subtotal0.009074100.00000000.028296
Redistribution Metal 2Copper and its compoundsCopper, metal7440-50-80.32475599.9900001.012646
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000320.0100000.000101
Subtotal0.324788100.00000001.012747
Solder BumpsCopper and its compoundsCopper, metal7440-50-80.18009356.5834000.561562
Nickel and its compoundsNickel, metal7440-02-00.0145374.5673000.045328
Silver and its compoundsSilver, metal7440-22-40.0022260.6993000.006940
Tin and its compoundsTin, metal7440-31-50.12142338.1500000.378620
Subtotal0.318279100.00000000.992450
Under Bump MetalCopper and its compoundsCopper, metal7440-50-80.00097379.5374000.003035
Titanium and its compoundsTitanium, metal7440-32-60.00025020.4626000.000781
Subtotal0.001224100.00000000.003816
Total32.070000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPF5302AMMA0ESR2
Product content declaration of MPF5302AMMA0ESR2
上次修订 Last Revision (GMT):
Sunday, 07 July 2024, 10:22:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

聚酰亚胺涂料
Polyimide Coating
OOOOOO

电气再分配
Redistribution Metal 1
OOOOOO

电气再分配
Redistribution Metal 2
OOOOOO

焊锡金属凸块
Solder Bumps
OOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPF5302AMMA0ESR2Last Revision (GMT):
Sunday, 07 July 2024, 10:22:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Copper Lead-Frame, Pre-Plated AgNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
15 Mar 2024
Test Report
15 Mar 2024
Test Report
15 Mar 2024
Test Report
15 Mar 2024
Post-plating - Lead FreeTest Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Semiconductor DieBUMPNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
POLYIMIDENot AvailableNot AvailableNot AvailableNot Available
RDL CUNot AvailableNot AvailableNot AvailableNot Available
RDL CU PLATINGNot AvailableNot AvailableNot AvailableNot Available
RDL TINot AvailableNot AvailableNot AvailableNot Available
UBM CUNot AvailableNot AvailableNot AvailableNot Available
UBM TINot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.