MPC8572ECVJAULE

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8572ECVJAULELast Revision (GMT):
Sunday, 15 January 2023, 03:22:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8572ECVJAULESOT1620-1BGA102310559.868000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 236 035572023-11-24113 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapCapCopper and its compoundsCopper, metal7440-50-85799.42000099.00000054.919437
Nickel and its compoundsNickel, metal7440-02-058.5800001.0000000.554742
Subtotal5858.000000100.000000055.474178
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-746.69560065.4000000.442199
Copper and its compoundsCopper, metal7440-50-89.85320013.8000000.093308
Nickel and its compoundsNickel, metal7440-02-013.92300019.5000000.131848
Tin and its compoundsTin, metal7440-31-50.9282001.3000000.008790
Subtotal71.400000100.00000000.676145
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-758.59000030.0000000.554836
Inorganic Silicon compoundsSilylated silica68909-20-67.8120004.0000000.073978
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0390600.0200000.000370
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-27.8120004.0000000.073978
Organic Silicon compoundsOther siloxanes and silicones5.8590003.0000000.055484
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-88.7885004.5000000.083225
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-2105.46200054.0000000.998706
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.5859000.3000000.005548
Organic compoundsOther organic compounds.0.2929500.1500000.002774
Platinum and its compoundsOther platinum compounds0.0585900.0300000.000555
Subtotal195.300000100.00000001.849455
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped227.58400089.6000002.155178
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.2860000.9000000.021648
Nickel and its compoundsNickel, metal7440-02-01.2700000.5000000.012027
Silver and its compoundsSilver, metal7440-22-40.8001000.3150000.007577
Tin and its compoundsTin, metal7440-31-522.0599008.6850000.208903
Subtotal254.000000100.00000002.405333
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-430.0369303.5000000.284444
Tin and its compoundsTin, metal7440-31-5828.16107096.5000007.842532
Subtotal858.198000100.00000008.126977
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-832.22135096.5000000.305130
Silver and its compoundsSilver, metal7440-22-41.0017003.0000000.009486
Tin and its compoundsTin, metal7440-31-50.1669500.5000000.001581
Subtotal33.390000100.00000000.316197
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8401.06262099.8700003.797989
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5220600.1300000.004944
Subtotal401.584680100.00000003.802933
Copper PlatingCopper and its compoundsCopper, metal7440-50-81114.44853699.75000010.553622
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.7931040.2500000.026450
Subtotal1117.241640100.000000010.580072
DielectricEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-529.93630710.4600000.283491
Inorganic Silicon compoundsSilicon dioxide7631-86-9119.77384641.8500001.134236
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-629.93630710.4600000.283491
PolymersPlastic: EP - Epoxide, Epoxy106.55150137.2300001.009023
Subtotal286.197960100.00000002.710242
Solder 1Copper and its compoundsCopper, metal7440-50-80.0162060.5000000.000153
Silver and its compoundsSilver, metal7440-22-40.0972363.0000000.000921
Tin and its compoundsTin, metal7440-31-53.12775896.5000000.029619
Subtotal3.241200100.00000000.030694
Solder 2Copper and its compoundsCopper, metal7440-50-80.0356530.5000000.000338
Silver and its compoundsSilver, metal7440-22-40.2139193.0000000.002026
Tin and its compoundsTin, metal7440-31-56.88106896.5000000.065162
Subtotal7.130640100.00000000.067526
Solder BallCopper and its compoundsCopper, metal7440-50-80.1701630.5000000.001611
Silver and its compoundsSilver, metal7440-22-41.0209783.0000000.009669
Tin and its compoundsTin, metal7440-31-532.84145996.5000000.311003
Subtotal34.032600100.00000000.322283
Solder MaskBarium and its compoundsBarium sulfate7727-43-715.77654129.5000000.149401
Inorganic compoundsProprietary Material - Other inorganic compounds0.3208790.6000000.003039
Magnesium and its compoundsTalc14807-96-61.7113543.2000000.016206
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2300352.3000000.011648
PolymersPlastic: EP - Epoxide, Epoxy10.58900019.8000000.100276
PolymersPlastic: PAK23.85199144.6000000.225874
Subtotal53.479800100.00000000.506444
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3508.73875240.0000004.817662
Inorganic Silicon compoundsSilica, vitreous60676-86-0445.14640835.0000004.215454
PolymersPlastic: EP - Epoxide, Epoxy317.96172025.0000003.011039
Subtotal1271.846880100.000000012.044155
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-134.79039352.3600000.329459
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-54.9235457.4100000.046625
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3455120.5200000.003272
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-614.85701322.3600000.140693
PolymersPlastic: EP - Epoxide, Epoxy11.52813817.3500000.109169
Subtotal66.444600100.00000000.629218
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-516.93300070.0000000.160352
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7257003.0000000.006872
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.2419001.0000000.002291
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.2419001.0000000.002291
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.41900010.0000000.022908
Zinc and its compoundsZinc oxide1314-13-23.62850015.0000000.034361
Subtotal24.190000100.00000000.229075
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-32.66090011.0000000.025198
Bismuth and its compoundsBismuth nitrate10361-44-10.0241900.1000000.000229
Bismuth and its compoundsBismuth trioxide1304-76-30.1935200.8000000.001833
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-63.38660014.0000000.032071
Epoxy ResinsOther Epoxy resins0.9676004.0000000.009163
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.41900010.0000000.022908
Inorganic Silicon compoundsSilica, vitreous60676-86-014.51400060.0000000.137445
Inorganic compoundsCarbon Black1333-86-40.0241900.1000000.000229
Subtotal24.190000100.00000000.229075
Total10559.868000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8572ECVJAULE
Product content declaration of MPC8572ECVJAULE
上次修订 Last Revision (GMT):
Sunday, 15 January 2023, 03:22:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
盖子
Cap
盖子
Cap
OOOOOO
电容器
Capacitor
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

电介质
Dielectric
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8572ECVJAULELast Revision (GMT):
Sunday, 15 January 2023, 03:22:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapNot AvailableNot AvailableNot AvailableNot Available
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Epoxy AdhesiveTest Report
26 Feb 2024
Test Report
26 Feb 2024
Test Report
26 Feb 2024
Not Available
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
SubstrateNot AvailableNot AvailableNot AvailableNot Available
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.