MPC8308CZQADDA

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of MPC8308CZQADDALast Revision (GMT):
Tuesday, 27 August 2024, 03:31:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8308CZQADDASOT1523-2LFBGA4731627.747819 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 217 025572023-11-2410Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-83.09225598.7998000.189971
Palladium and its compoundsPalladium, metal7440-05-30.0375641.2002000.002308
Subtotal3.129819100.00000000.192279
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins25.8150005.0000001.585934
Inorganic Silicon compoundsSilica, vitreous60676-86-0345.92100067.00000021.251511
Inorganic Silicon compoundsSilicon dioxide7631-86-9129.07500025.0000007.929668
Inorganic compoundsCarbon Black1333-86-42.5815000.5000000.158593
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins12.9075002.5000000.792967
Subtotal516.300000100.000000031.718673
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.71000045.0000000.105053
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0003800.0100000.000023
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1900005.0000000.011673
PolymersPlastic: EP - Epoxide, Epoxy1.89962049.9900000.116702
Subtotal3.800000100.00000000.233451
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-323.42200098.0000001.438921
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4780002.0000000.029366
Subtotal23.900000100.00000001.468286
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0036650.0025000.000225
Antimony and its compoundsAntimony, metal7440-36-00.0146620.0100000.000901
Arsenic and its compoundsArsenic, metal7440-38-20.0146620.0100000.000901
Bismuth and its compoundsBismuth, metal7440-69-90.0219930.0150000.001351
Cadmium and its compoundsCadmium, metal7440-43-90.0014660.0010000.000090
Copper and its compoundsCopper, metal7440-50-80.0073310.0050000.000450
Gold and its compoundsGold, metal7440-57-50.0073310.0050000.000450
Indium and its compoundsIndium, metal7440-74-60.0073310.0050000.000450
Inorganic compoundsSulfur7704-34-90.0014660.0010000.000090
Iron and its compoundsIron, metal7439-89-60.0146620.0100000.000901
Lead and its compoundsLead, metallic lead and lead alloys7439-92-152.74377335.9736003.240291
Nickel and its compoundsNickel, metal7440-02-00.0036650.0025000.000225
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0073310.0050000.000450
Silver and its compoundsSilver, metal7440-22-42.9301611.9985000.180013
Tin and its compoundsTin, metal7440-31-590.83630261.9544005.580490
Zinc and its compoundsZinc, metal7440-66-60.0021990.0015000.000135
Subtotal146.618000100.00000009.007415
Substrate, Pre-plated NiAuCopper Foil 1Copper and its compoundsCopper, metal7440-50-8107.11908799.9900006.580816
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0107130.0100000.000658
Subtotal107.129800100.00000006.581474
Copper Foil 2Copper and its compoundsCopper, metal7440-50-8125.23687599.9900007.693874
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0125250.0100000.000770
Subtotal125.249400100.00000007.694644
Copper PlatingCopper and its compoundsCopper, metal7440-50-8184.82011699.99000011.354346
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0184840.0100000.001136
Subtotal184.838600100.000000011.355481
Gold PlatingGold and its compoundsGold, metal7440-57-514.00859999.9900000.860612
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0014010.0100000.000086
Subtotal14.010000100.00000000.860699
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0134960.0100000.000829
Nickel and its compoundsNickel, metal7440-02-0134.94950499.9900008.290566
Subtotal134.963000100.00000008.291395
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0540790.1000000.003322
Barium and its compoundsBarium sulfate7727-43-715.73687329.1000000.966788
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3244720.6000000.019934
Magnesium and its compoundsTalc14807-96-61.6223583.0000000.099669
Organic compoundsOther organic compounds.1.9468303.6000000.119603
PolymersPlastic: EP - Epoxide, Epoxy10.54532719.5000000.647848
PolymersPlastic: PAK23.84866344.1000001.465132
Subtotal54.078600100.00000003.322296
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-341.90297632.0000002.574292
Inorganic Silicon compoundsSilica, vitreous60676-86-07.8568086.0000000.482680
PolymersPlastic: PI - Polyimide81.18701662.0000004.987690
Subtotal130.946800100.00000008.044661
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-367.63000637.0000004.154821
Inorganic Silicon compoundsSilica, vitreous60676-86-029.24540816.0000001.796679
PolymersPlastic: PI - Polyimide85.90838647.0000005.277745
Subtotal182.783800100.000000011.229246
Total1627.747819100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8308CZQADDA
Product content declaration of MPC8308CZQADDA
上次修订 Last Revision (GMT):
Tuesday, 27 August 2024, 03:31:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8308CZQADDALast Revision (GMT):
Tuesday, 27 August 2024, 03:31:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuAU PLATINGTest Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
AUS308Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
3 Jun 2021
Test Report
3 Jun 2021
Test Report
3 Jun 2021
Test Report
3 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.