MPC5554MZP132R2

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC5554MZP132R2Last Revision (GMT):
Monday, 02 September 2024, 06:59:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC5554MZP132R2SOT1705-1BGA4163053.996022 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 095 965182023-11-247Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-510.48097499.9900000.343189
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0010480.0100000.000034
Subtotal10.482022100.00000000.343223
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins70.8900006.0000002.321221
Inorganic Silicon compoundsSilica, vitreous60676-86-0874.31000074.00000028.628394
Inorganic Silicon compoundsSilicon dioxide7631-86-9177.22500015.0000005.803053
Inorganic compoundsCarbon Black1333-86-45.9075000.5000000.193435
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-423.6300002.0000000.773740
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins29.5375002.5000000.967175
Subtotal1181.500000100.000000038.687018
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.08800012.0000000.068369
Epoxy ResinsProprietary Material-Other Epoxy resins1.2180007.0000000.039882
Silver and its compoundsSilver, metal7440-22-414.09400081.0000000.461494
Subtotal17.400000100.00000000.569745
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped41.11100098.0000001.346138
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8390002.0000000.027472
Subtotal41.950000100.00000001.373610
Solder Ball - Low LeadSolder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1149.38704036.0000004.891527
Silver and its compoundsSilver, metal7440-22-48.2992802.0000000.271751
Tin and its compoundsTin, metal7440-31-5257.27768062.0000008.424297
Subtotal414.964000100.000000013.587575
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAromatic hydrocarbon compoundsProprietary Material-Other Aromatic carbonyl compounds4.8722150.3511000.159536
Barium and its compoundsBarium sulfate7727-43-730.6209882.2066001.002653
Copper and its compoundsCopper, metal7440-50-8172.59241212.4373005.651363
Epoxy ResinsProprietary Material-Other Epoxy resins41.0606552.9589001.344489
Gold and its compoundsGold, metal7440-57-52.5755710.1856000.084335
Halogenated Organic CompoundsOther halogenated organic compounds0.2081550.0150000.006816
Inorganic Silicon compoundsQuartz14808-60-7638.17408845.98790020.896363
Nickel and its compoundsNickel, metal7440-02-016.0071201.1535000.524137
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)481.58879634.70410015.769136
Subtotal1387.700000100.000000045.438828
Total3053.996022100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC5554MZP132R2
Product content declaration of MPC5554MZP132R2
上次修订 Last Revision (GMT):
Monday, 02 September 2024, 06:59:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC5554MZP132R2Last Revision (GMT):
Monday, 02 September 2024, 06:59:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder Ball - Low LeadTest Report
8 Oct 2021
Test Report
8 Oct 2021
Test Report
8 Oct 2021
Test Report
8 Nov 2021
Substrate, Pre-plated NiAuAUS 703Test Report
18 Mar 2024
Test Report
18 Mar 2024
Test Report
11 Oct 2023
Test Report
11 Oct 2023
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
14 Dec 2022
Test Report
21 Dec 2021
PHP-900 IR-6Test Report
18 Mar 2024
Test Report
18 Jun 2023
Test Report
20 Apr 2023
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.