MKM14Z64CHH5

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MKM14Z64CHH5Last Revision (GMT):
Friday, 30 August 2024, 11:44:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MKM14Z64CHH5SOT1638-1HVQFN44R136.400049 mg YesYesYesNickel/Gold (Ni/Au)Othere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 247 165572023-11-2493 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-80.58204897.0000000.426721
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0180023.0000000.013198
Subtotal0.600049100.00000000.439918
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins2.9640006.0000002.173020
Inorganic Silicon compoundsSilica, vitreous60676-86-036.55600074.00000026.800577
Inorganic Silicon compoundsSilicon dioxide7631-86-97.41000015.0000005.432549
Inorganic compoundsCarbon Black1333-86-40.2470000.5000000.181085
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.9880002.0000000.724340
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins1.2350002.5000000.905425
Subtotal49.400000100.000000036.216996
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.22500045.0000000.164956
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0000500.0100000.000037
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0250005.0000000.018328
PolymersPlastic: EP - Epoxide, Epoxy0.24995049.9900000.183248
Subtotal0.500000100.00000000.366569
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped38.51400098.00000028.236060
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7860002.0000000.576246
Subtotal39.300000100.000000028.812306
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-89.70580999.9900007.115693
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0009710.0100000.000712
Subtotal9.706780100.00000007.116405
Copper PlatingCopper and its compoundsCopper, metal7440-50-812.35242599.9900009.056026
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0012350.0100000.000906
Subtotal12.353660100.00000009.056932
Gold PlatingGold and its compoundsGold, metal7440-57-50.87133399.9900000.638807
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000870.0100000.000064
Subtotal0.871420100.00000000.638871
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0025290.0300000.001854
Nickel and its compoundsNickel, metal7440-02-08.42741199.9700006.178452
Subtotal8.429940100.00000006.180306
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0033780.1000000.002477
Barium and its compoundsBarium sulfate7727-43-70.98314329.1000000.720779
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0202710.6000000.014861
Magnesium and its compoundsTalc14807-96-60.1013553.0000000.074307
Organic compoundsOther organic compounds.0.1216263.6000000.089169
PolymersPlastic: EP - Epoxide, Epoxy0.65880719.5000000.482996
PolymersPlastic: PAK1.48991844.1000001.092315
Subtotal3.378500100.00000002.476905
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-33.79510432.0000002.782333
Inorganic Silicon compoundsSilica, vitreous60676-86-00.7115826.0000000.521687
PolymersPlastic: PI - Polyimide7.35301462.0000005.390771
Subtotal11.859700100.00000008.694792
Total136.400049100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MKM14Z64CHH5
Product content declaration of MKM14Z64CHH5
上次修订 Last Revision (GMT):
Friday, 30 August 2024, 11:44:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MKM14Z64CHH5Last Revision (GMT):
Friday, 30 August 2024, 11:44:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
28 Mar 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
AUS308Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Not AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.