MIMX8UD3DVP08SC

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MIMX8UD3DVP08SCLast Revision (GMT):
Sunday, 01 September 2024, 09:27:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MIMX8UD3DVP08SCSOT2052LFBGA485516.969577 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 479 785572023-11-24103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-82.61885598.1000000.506578
Gold and its compoundsGold, metal7440-57-50.0026700.1000000.000516
Palladium and its compoundsPalladium, metal7440-05-30.0480521.8000000.009295
Subtotal2.669577100.00000000.516390
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins12.6550005.0000002.447920
Inorganic Silicon compoundsSilica, vitreous60676-86-0169.57700067.00000032.802124
Inorganic Silicon compoundsSilicon dioxide7631-86-963.27500025.00000012.239598
Inorganic compoundsCarbon Black1333-86-41.2655000.5000000.244792
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins6.3275002.5000001.223960
Subtotal253.100000100.000000048.958394
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.85500045.0000000.165387
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001900.0100000.000037
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0950005.0000000.018376
PolymersPlastic: EP - Epoxide, Epoxy0.94981049.9900000.183726
Subtotal1.900000100.00000000.367526
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-313.13200098.0000002.540188
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2680002.0000000.051841
Subtotal13.400000100.00000002.592029
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.3125000.5000000.060448
Silver and its compoundsSilver, metal7440-22-40.6250001.0000000.120897
Tin and its compoundsTin, metal7440-31-561.56250098.50000011.908341
Subtotal62.500000100.000000012.089686
SubstrateCopper CoreCopper and its compoundsCopper, metal7440-50-845.27693299.9900008.758142
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0045280.0100000.000876
Subtotal45.281460100.00000008.759018
Copper PlatingCopper and its compoundsCopper, metal7440-50-869.51303599.98000013.446252
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0139050.0200000.002690
Subtotal69.526940100.000000013.448942
Gold PlatingGold and its compoundsGold, metal7440-57-50.62349899.9900000.120606
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000620.0100000.000012
Subtotal0.623560100.00000000.120618
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0011830.0300000.000229
Nickel and its compoundsNickel, metal7440-02-03.94191799.9700000.762505
Subtotal3.943100100.00000000.762733
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0259510.1000000.005020
Barium and its compoundsBarium sulfate7727-43-77.55177029.1000001.460776
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1557070.6000000.030119
Magnesium and its compoundsTalc14807-96-60.7785333.0000000.150595
Organic compoundsOther organic compounds.0.9342403.6000000.180715
PolymersPlastic: EP - Epoxide, Epoxy5.06046519.5000000.978871
PolymersPlastic: PAK11.44443544.1000002.213754
Subtotal25.951100100.00000005.019851
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-315.79186846.6700003.054700
Inorganic Silicon compoundsSilica, vitreous60676-86-02.2535646.6600000.435918
PolymersPlastic: PI - Polyimide15.79186846.6700003.054700
Subtotal33.837300100.00000006.545318
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-31.97719346.6700000.382458
Inorganic Silicon compoundsSilica, vitreous60676-86-00.2821546.6600000.054578
PolymersPlastic: PI - Polyimide1.97719346.6700000.382458
Subtotal4.236540100.00000000.819495
Total516.969577100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MIMX8UD3DVP08SC
Product content declaration of MIMX8UD3DVP08SC
上次修订 Last Revision (GMT):
Sunday, 01 September 2024, 09:27:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MIMX8UD3DVP08SCLast Revision (GMT):
Sunday, 01 September 2024, 09:27:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
SubstrateAUS308Not AvailableNot AvailableNot AvailableNot Available
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Not AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.