MF0AES2000DA8J
As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.
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| NXP Semiconductors | ||
| Product content declaration of MF0AES2000DA8J | Last Revision (GMT): Monday, 23 September 2024, 07:15:00 AM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| MF0AES2000DA8J | SOT500 | PLLMC | 13.528204 mg | No | Yes | Yes | Silver (Ag) | Cu alloy | e4 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9354 239 73118 | 2023-11-25 | 7 | NA / Not Available | Not Applicable | Not Applicable | NA / Not Available | Not Applicable | Not Applicable | Not Applicable | Bangkok, Thailand |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Bonding Wire - Au | Bonding Wire - Au | Calcium and its compounds | Calcium | 7440-70-2 | 0.000001 | 0.002000 | 0.000002 |
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.012833 | 98.840000 | 0.094864 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000001 | 0.008000 | 0.000008 | |||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.000149 | 1.150000 | 0.001104 | ||
| Subtotal | 0.012984 | 100.0000000 | 0.095977 | ||||
| Copper Lead-Frame, Pre-Plated Ag | Copper Lead-Frame, Pre-Plated Ag | Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 9.300000 | 100.000000 | 68.745267 |
| Subtotal | 9.300000 | 100.0000000 | 68.745267 | ||||
| Die Encapsulant | Die Encapsulant | Antimony Oxides | Antimony(III) oxide | 1309-64-4 | 0.078000 | 2.000000 | 0.576573 |
| Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.039000 | 1.000000 | 0.288287 | ||
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 2.730000 | 70.000000 | 20.180062 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.273000 | 7.000000 | 2.018006 | ||
| Inorganic compounds | Carbon Black | 1333-86-4 | 0.011700 | 0.300000 | 0.086486 | ||
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.066300 | 1.700000 | 0.490087 | |||
| Polymers | Plastic: EP - Epoxide, Epoxy | 0.702000 | 18.000000 | 5.189159 | |||
| Subtotal | 3.900000 | 100.0000000 | 28.828660 | ||||
| Epoxy Adhesive | Epoxy Adhesive | Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.003000 | 3.000000 | 0.022176 |
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 0.055000 | 55.000000 | 0.406558 | ||
| Organic compounds | Other organic compounds. | 0.002000 | 2.000000 | 0.014784 | |||
| Polymers | Fatty acids, C18-unsatd., dimers, polymers with epichlorohydrin | 68475-94-5 | 0.005000 | 5.000000 | 0.036960 | ||
| Polymers | Plastic: EP - Epoxide, Epoxy | 0.035000 | 35.000000 | 0.258719 | |||
| Subtotal | 0.100000 | 100.0000000 | 0.739196 | ||||
| Pre-plating - Precious metal - Ag | Pre-plating - Precious metal - Ag | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000010 | 0.010000 | 0.000074 | |
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.099990 | 99.990000 | 0.739123 | ||
| Subtotal | 0.100000 | 100.0000000 | 0.739196 | ||||
| Semiconductor Die | Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.103887 | 98.000000 | 0.767929 |
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.002120 | 2.000000 | 0.015672 | |||
| Subtotal | 0.106007 | 100.0000000 | 0.783601 | ||||
| Metallization Layer | Gold and its compounds | Gold, metal | 7440-57-5 | 0.007212 | 99.990000 | 0.053311 | |
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000001 | 0.010000 | 0.000005 | |||
| Subtotal | 0.007213 | 100.0000000 | 0.053317 | ||||
| Under Bump Metal 1 | Titanium and its compounds | Titanium, metal | 7440-32-6 | 0.000025 | 2.500000 | 0.000185 | |
| Tungsten and its compounds | Tungsten, metal | 7440-33-7 | 0.000975 | 97.500000 | 0.007207 | ||
| Subtotal | 0.001000 | 100.0000000 | 0.007392 | ||||
| Under Bump Metal 2 | Gold and its compounds | Gold, metal | 7440-57-5 | 0.000999 | 99.990000 | 0.007391 | |
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000001 | 0.010000 | 0.000001 | |||
| Subtotal | 0.001000 | 100.0000000 | 0.007392 | ||||
| Total | 13.528204 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 MF0AES2000DA8J Product content declaration of MF0AES2000DA8J | 上次修订 Last Revision (GMT): Monday, 23 September 2024, 07:15:00 AM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
| 焊丝-金 Bonding Wire - Au | 焊丝-金 Bonding Wire - Au | O | O | O | O | O | O |
| 铜引线框架，预镀银 Copper Lead-Frame, Pre-Plated Ag | 铜引线框架，预镀银 Copper Lead-Frame, Pre-Plated Ag | O | O | O | O | O | O |
| 芯片密封胶 Die Encapsulant | 芯片密封胶 Die Encapsulant | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 预镀 - 贵金属 - 银 Pre-plating - Precious metal - Ag | 预镀 - 贵金属 - 银 Pre-plating - Precious metal - Ag | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die | 半导体芯片 Die | O | O | O | O | O | O |
| | 金属化层 Metallization Layer | O | O | O | O | O | O |
| | 焊料凸点下的金属 Under Bump Metal 1 | O | O | O | O | O | O |
| | 焊料凸点下的金属 Under Bump Metal 2 | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| 备注： 该半导体产品具有无限期的环保使用期限（EFUP）。 |
| Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP). |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of MF0AES2000DA8J | Last Revision (GMT): Monday, 23 September 2024, 07:15:00 AM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Bonding Wire - Au | Test Report 3 Jul 2024 | Test Report 3 Jul 2024 | Test Report 3 Jul 2024 | Test Report 3 Jul 2024 | |
| Copper Lead-Frame, Pre-Plated Ag | Test Report 20 May 2020 | Test Report 20 May 2020 | Test Report 20 May 2020 | Test Report 16 Aug 2019 | |
| Die Encapsulant | Test Report 3 Oct 2024 | Test Report 3 Oct 2024 | Test Report 3 Oct 2024 | Not Available | |
| Epoxy Adhesive | Test Report 30 Aug 2023 | Test Report 30 Aug 2023 | Test Report 30 Aug 2023 | Test Report 30 Aug 2023 | |
| Pre-plating - Precious metal - Ag | Test Report 29 Dec 2023 | Test Report 29 Dec 2023 | Test Report 29 Dec 2023 | Test Report 29 Dec 2023 | |
| Semiconductor Die | AU BUMP | Test Report 15 Dec 2023 | Test Report 15 Dec 2023 | Test Report 15 Dec 2023 | Test Report 15 Dec 2023 |
| DIE | Test Report 18 Jun 2024 | Test Report 18 Jun 2024 | Test Report 18 Jun 2024 | Test Report 18 Jun 2024 | |
| TIW UBM | Test Report 23 Feb 2021 | Test Report 23 Feb 2021 | Test Report 23 Feb 2021 | Test Report 23 Feb 2021 | |
| For more information: contact us | |||||
| Note(s): |
|---|
| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |