MCF5485CZP200

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCF5485CZP200Last Revision (GMT):
Wednesday, 21 August 2024, 01:43:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCF5485CZP200SOT1712-1BGA3883298.235151 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 136 185572023-11-246Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-517.79937199.9900000.539663
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0017800.0100000.000054
Subtotal17.801151100.00000000.539717
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins87.4680006.0000002.651964
Inorganic Silicon compoundsSilica, vitreous60676-86-01078.77200074.00000032.707553
Inorganic Silicon compoundsSilicon dioxide7631-86-9218.67000015.0000006.629909
Inorganic compoundsCarbon Black1333-86-47.2890000.5000000.220997
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-429.1560002.0000000.883988
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins36.4450002.5000001.104985
Subtotal1457.800000100.000000044.199396
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.13600012.0000000.064762
Epoxy ResinsProprietary Material-Other Epoxy resins1.2460007.0000000.037778
Silver and its compoundsSilver, metal7440-22-414.41800081.0000000.437143
Subtotal17.800000100.00000000.539683
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped39.20000098.0000001.188514
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8000002.0000000.024255
Subtotal40.000000100.00000001.212770
Solder Ball - Low LeadSolder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1139.33224036.0000004.224448
Silver and its compoundsSilver, metal7440-22-47.7406802.0000000.234692
Tin and its compoundsTin, metal7440-31-5239.96108062.0000007.275439
Subtotal387.034000100.000000011.734579
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8270.02179599.9900008.186857
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0270050.0100000.000819
Subtotal270.048800100.00000008.187676
Copper PlatingCopper and its compoundsCopper, metal7440-50-8438.05277299.98000013.281429
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0876280.0200000.002657
Subtotal438.140400100.000000013.284086
Gold PlatingGold and its compoundsGold, metal7440-57-51.23989699.9900000.037593
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001240.0100000.000004
Subtotal1.240020100.00000000.037596
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0023150.0300000.000070
Nickel and its compoundsNickel, metal7440-02-07.71336599.9700000.233863
Subtotal7.715680100.00000000.233934
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0513920.1000000.001558
Barium and its compoundsBarium sulfate7727-43-714.95505429.1000000.453426
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3083520.6000000.009349
Magnesium and its compoundsTalc14807-96-61.5417583.0000000.046745
Organic compoundsOther organic compounds.1.8501103.6000000.056094
PolymersPlastic: EP - Epoxide, Epoxy10.02142819.5000000.303842
PolymersPlastic: PAK22.66384644.1000000.687151
Subtotal51.391940100.00000001.558165
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-385.81897347.6200002.601967
Inorganic Silicon compoundsSilica, vitreous60676-86-08.5782934.7600000.260087
PolymersPlastic: PI - Polyimide85.81897347.6200002.601967
Subtotal180.216240100.00000005.464020
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-3137.29501432.0000004.162681
Inorganic Silicon compoundsSilica, vitreous60676-86-025.7428156.0000000.780503
PolymersPlastic: PI - Polyimide266.00909062.0000008.065195
Subtotal429.046920100.000000013.008379
Total3298.235151100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCF5485CZP200
Product content declaration of MCF5485CZP200
上次修订 Last Revision (GMT):
Wednesday, 21 August 2024, 01:43:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCF5485CZP200Last Revision (GMT):
Wednesday, 21 August 2024, 01:43:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder Ball - Low LeadTest Report
8 Oct 2021
Test Report
8 Oct 2021
Test Report
8 Oct 2021
Test Report
8 Nov 2021
Substrate, Pre-plated NiAuAUS 703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
SOLDER MASKNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.