FXTH87EH226T1
As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.
Download
| NXP Semiconductors | ||
| Product content declaration of FXTH87EH226T1 | Last Revision (GMT): Wednesday, 19 March 2025, 03:55:00 PM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| FXTH87EH226T1 | SOT1575 | HQFN24 | 293.299978 mg | Yes | No | Yes | Other | Cu alloy | e4 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9353 470 07528 | 2023-11-24 | 11 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 260 | 40 sec. | 3 | External manufacturing |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Bonding Wire - Au 1 | Bonding Wire - Au | Gold and its compounds | Gold, metal | 7440-57-5 | 0.099974 | 99.990000 | 0.034086 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000010 | 0.010000 | 0.000003 | |||
| Subtotal | 0.099984 | 100.0000000 | 0.034089 | ||||
| Bonding Wire - Au 2 | Bonding Wire - Au | Gold and its compounds | Gold, metal | 7440-57-5 | 0.399954 | 99.990000 | 0.136363 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000040 | 0.010000 | 0.000014 | |||
| Subtotal | 0.399994 | 100.0000000 | 0.136377 | ||||
| Copper Lead-Frame, Pre-Plated | Copper Lead-Frame, Pre-Plated | Copper and its compounds | Copper, metal | 7440-50-8 | 6.982294 | 96.976300 | 2.380598 |
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.001368 | 0.019000 | 0.000466 | ||
| Iron and its compounds | Iron, metal | 7439-89-6 | 0.153814 | 2.136300 | 0.052442 | ||
| Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.000072 | 0.001000 | 0.000024 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.057312 | 0.796000 | 0.019540 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.001800 | 0.025000 | 0.000614 | ||
| Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.002045 | 0.028400 | 0.000697 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.001296 | 0.018000 | 0.000442 | ||
| Subtotal | 7.200000 | 100.0000000 | 2.454825 | ||||
| Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 7.972000 | 4.000000 | 2.718036 | |
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 146.485500 | 73.500000 | 49.943918 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 31.888000 | 16.000000 | 10.872145 | ||
| Inorganic compounds | Carbon Black | 1333-86-4 | 0.996500 | 0.500000 | 0.339755 | ||
| Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 11.958000 | 6.000000 | 4.077055 | |||
| Subtotal | 199.300000 | 100.0000000 | 67.950908 | ||||
| Epoxy Adhesive 1 | Epoxy Adhesive | Epoxy Resins | Other Epoxy resins | 0.372000 | 93.000000 | 0.126833 | |
| Organic Silicon compounds | (3,4-Epoxycyclohexyl)ethyltrimethoxysilane | 3388-04-3 | 0.008000 | 2.000000 | 0.002728 | ||
| Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.020000 | 5.000000 | 0.006819 | ||
| Subtotal | 0.400000 | 100.0000000 | 0.136379 | ||||
| Epoxy Adhesive 2 | Epoxy Adhesive | Acrylates | Ditrimethylolpropane tetraacrylate | 94108-97-1 | 0.005000 | 5.000000 | 0.001705 |
| Aromatic hydrocarbon compounds | Hydroquinone | 123-31-9 | 0.000050 | 0.050000 | 0.000017 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.015000 | 15.000000 | 0.005114 | ||
| Inorganic Silicon compounds | Silylated silica | 68909-20-6 | 0.049950 | 49.950000 | 0.017030 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.005000 | 5.000000 | 0.001705 | |||
| Organic compounds | Fatty acids, C18-unsatd., dimers, hydrogenated, polymers with hydrogenated di-Me esters of hydrogenated C18-unsatd. fatty acid dimer | 177591-08-1 | 0.020000 | 20.000000 | 0.006819 | ||
| Polymers | 2-Propenoic acid,2-methyl-, 1,1'-(2,2-dimethyl-1,3-propanediyl) ester | 1985-51-9 | 0.005000 | 5.000000 | 0.001705 | ||
| Subtotal | 0.100000 | 100.0000000 | 0.034095 | ||||
| Epoxy Adhesive 3 | Epoxy Adhesive | Epoxy Resins | Other Epoxy resins | 0.396000 | 99.000000 | 0.135015 | |
| Inorganic compounds | Carbon Black | 1333-86-4 | 0.004000 | 1.000000 | 0.001364 | ||
| Subtotal | 0.400000 | 100.0000000 | 0.136379 | ||||
| Epoxy Adhesive 4 | Epoxy Adhesive | Epoxy Resins | Epichlorohydrin, o-cresol, formaldehyde polymer | 29690-82-2 | 0.010000 | 10.000000 | 0.003410 |
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.025000 | 25.000000 | 0.008524 | ||
| Phenols and Phenolic Resins | Phenol p-xylylene dimethyl ether copolymer | 26834-02-6 | 0.030000 | 30.000000 | 0.010228 | ||
| Phenols and Phenolic Resins | Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane | 25068-38-6 | 0.025000 | 25.000000 | 0.008524 | ||
| Polymers | Acrylic acid ester copolymer | 78506-70-4 | 0.010000 | 10.000000 | 0.003410 | ||
| Subtotal | 0.100000 | 100.0000000 | 0.034095 | ||||
| Lid | Lid | Chromium and Chromium III compounds | Chromium, metal | 7440-47-3 | 12.624118 | 18.138100 | 4.304166 |
| Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.437714 | 0.628900 | 0.149238 | ||
| Inorganic compounds | Carbon | 7440-44-0 | 0.034730 | 0.049900 | 0.011841 | ||
| Inorganic compounds | Sulfur | 7704-34-9 | 0.002088 | 0.003000 | 0.000712 | ||
| Iron and its compounds | Iron, metal | 7439-89-6 | 49.574340 | 71.227500 | 16.902265 | ||
| Manganese and its compounds | Manganese, metal | 7439-96-5 | 0.729547 | 1.048200 | 0.248738 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 5.989010 | 8.604900 | 2.041940 | ||
| Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.208452 | 0.299500 | 0.071071 | ||
| Subtotal | 69.600000 | 100.0000000 | 23.729971 | ||||
| Semiconductor Die 1 | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 6.272000 | 98.000000 | 2.138425 | |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.128000 | 2.000000 | 0.043641 | |||
| Subtotal | 6.400000 | 100.0000000 | 2.182066 | ||||
| Semiconductor Die 2 | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 2.548000 | 98.000000 | 0.868735 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.052000 | 2.000000 | 0.017729 | |||
| Subtotal | 2.600000 | 100.0000000 | 0.886464 | ||||
| Thermally Conductive Gel 1 | Thermally Conductive Gel | Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.201000 | 6.000000 | 0.068530 |
| Organic Silicon compounds | Dimethylvinylated and trimethylated silica | 68988-89-6 | 0.904500 | 27.000000 | 0.308387 | ||
| Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 2.244500 | 67.000000 | 0.765258 | ||
| Subtotal | 3.350000 | 100.0000000 | 1.142175 | ||||
| Thermally Conductive Gel 2 | Thermally Conductive Gel | Organic Silicon compounds | Dimethylvinylated and trimethylated silica | 68988-89-6 | 1.218181 | 36.363600 | 0.415336 |
| Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 2.030304 | 60.606100 | 0.692228 | ||
| Organic Silicon compounds | Tetra (trimethylsiloxy) silane | 3555-47-3 | 0.101515 | 3.030300 | 0.034611 | ||
| Subtotal | 3.350000 | 100.0000000 | 1.142175 | ||||
| Total | 293.299978 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 FXTH87EH226T1 Product content declaration of FXTH87EH226T1 | 上次修订 Last Revision (GMT): Wednesday, 19 March 2025, 03:55:00 PM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
| 焊丝-金 Bonding Wire - Au 1 | 焊丝-金 Bonding Wire - Au | O | O | O | O | O | O |
| 焊丝-金 Bonding Wire - Au 2 | 焊丝-金 Bonding Wire - Au | O | O | O | O | O | O |
| 铜引线框架，预镀 Copper Lead-Frame, Pre-Plated | 铜引线框架，预镀 Copper Lead-Frame, Pre-Plated | O | O | O | O | O | O |
| 芯片密封胶 Die Encapsulant | 芯片密封胶 Die Encapsulant | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive 1 | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive 2 | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive 3 | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive 4 | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 盖子 Lid | 盖子 Lid | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 1 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 2 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| 导热凝胶 Thermally Conductive Gel 1 | 导热凝胶 Thermally Conductive Gel | O | O | O | O | O | O |
| 导热凝胶 Thermally Conductive Gel 2 | 导热凝胶 Thermally Conductive Gel | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| 备注： 该半导体产品的环保使用期限（EFUP）为50年。 |
| Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years. |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of FXTH87EH226T1 | Last Revision (GMT): Wednesday, 19 March 2025, 03:55:00 PM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Bonding Wire - Au 1 | Test Report 11 Feb 2025 | Test Report 11 Feb 2025 | Test Report 11 Feb 2025 | Test Report 11 Feb 2025 | |
| Bonding Wire - Au 2 | Test Report 11 Feb 2025 | Test Report 11 Feb 2025 | Test Report 11 Feb 2025 | Test Report 11 Feb 2025 | |
| Copper Lead-Frame, Pre-Plated | Test Report 14 Jan 2019 | Test Report 14 Jan 2019 | Test Report 14 Jan 2019 | Test Report 14 Jan 2019 | |
| Die Encapsulant | Test Report 14 Oct 2024 | Test Report 14 Oct 2024 | Test Report 14 Oct 2024 | Test Report 14 Oct 2024 | |
| Epoxy Adhesive 1 | Test Report 4 Jul 2024 | Test Report 4 Jul 2024 | Test Report 4 Jul 2024 | Test Report 4 Jul 2024 | |
| Epoxy Adhesive 2 | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | |
| Epoxy Adhesive 3 | Test Report 13 Nov 2024 | Test Report 13 Nov 2024 | Test Report 13 Nov 2024 | Test Report 13 Nov 2024 | |
| Epoxy Adhesive 4 | Test Report 6 Nov 2024 | Test Report 6 Nov 2024 | Test Report 6 Nov 2024 | Test Report 22 Nov 2023 | |
| Lid | Test Report 22 Dec 2023 | Test Report 22 Dec 2023 | Test Report 22 Dec 2023 | Test Report 22 Dec 2023 | |
| Semiconductor Die 1 | Test Report 18 Dec 2024 | Test Report 18 Dec 2024 | Test Report 18 Dec 2024 | Test Report 18 Dec 2024 | |
| Semiconductor Die 2 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
| Thermally Conductive Gel 1 | Test Report 27 Feb 2025 | Test Report 27 Feb 2025 | Test Report 27 Feb 2025 | Test Report 27 Feb 2025 | |
| Thermally Conductive Gel 2 | Test Report 27 Feb 2025 | Test Report 27 Feb 2025 | Test Report 27 Feb 2025 | Test Report 27 Feb 2025 | |
| For more information: contact us | |||||
| Note(s): |
|---|
| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |