AFSC5G37E38T2

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Product content declaration of AFSC5G37E38T2		Last Revision (GMT): Monday, 13 May 2024, 08:17:00 PM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G37E38T2	SOT1831	HLLGA27	126.671598 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Palladium/Gold (Ni/Pd/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 159 64528	2023-11-24	5	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.575040	99.990000	0.453962
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000058	0.010000	0.000045
			Subtotal		0.575098	100.0000000	0.454007

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.042235
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.008447
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.016894
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.101364
			Subtotal		0.214000	100.0000000	0.168941
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.007104
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.007105
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.005526
			Subtotal		0.007000	100.0000000	0.005526
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001263
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.056840
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.005052
			Subtotal		0.080000	100.0000000	0.063155
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.015787
			Subtotal		0.020000	100.0000000	0.015789

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.107000	25.000000	0.084470
		Manganese and its compounds	Manganese oxide	1344-43-0	0.021400	5.000000	0.016894
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.042800	10.000000	0.033788
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.256800	60.000000	0.202729
			Subtotal		0.428000	100.0000000	0.337882
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.017998	99.990000	0.014209
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
			Subtotal		0.018000	100.0000000	0.014210
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013999	99.990000	0.011051
			Subtotal		0.014000	100.0000000	0.011052
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003200	2.000000	0.002526
		Copper and its compounds	Copper, metal	7440-50-8	0.144000	90.000000	0.113680
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.012800	8.000000	0.010105
			Subtotal		0.160000	100.0000000	0.126311
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.039996	99.990000	0.031575
			Subtotal		0.040000	100.0000000	0.031578

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.049185
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.009837
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.019674
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.118044
			Subtotal		0.249213	100.0000000	0.196739
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.008273
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.008274
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.006435
			Subtotal		0.008152	100.0000000	0.006435
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001471
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.066193
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.005884
			Subtotal		0.093163	100.0000000	0.073547
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.018385
			Subtotal		0.023291	100.0000000	0.018387

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.018953
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003791
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.007581
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.045486
			Subtotal		0.096030	100.0000000	0.075810
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.003151
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.003155
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.004727
			Subtotal		0.005994	100.0000000	0.004732
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000947
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.042626
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003789
			Subtotal		0.059994	100.0000000	0.047362
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000011
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.011030
			Subtotal		0.013986	100.0000000	0.011041

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.088027	25.000000	0.069493
		Manganese and its compounds	Manganese oxide	1344-43-0	0.017605	5.000000	0.013898
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.035211	10.000000	0.027797
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.211266	60.000000	0.166783
			Subtotal		0.352110	100.0000000	0.277971
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.014637	99.900000	0.011555
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000015	0.100000	0.000012
			Subtotal		0.014652	100.0000000	0.011567
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000022	0.100000	0.000017
		Nickel and its compounds	Nickel, metal	7440-02-0	0.021956	99.900000	0.017333
			Subtotal		0.021978	100.0000000	0.017350
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.004400	2.000000	0.003473
		Copper and its compounds	Copper, metal	7440-50-8	0.197980	90.000000	0.156294
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.017598	8.000000	0.013893
			Subtotal		0.219978	100.0000000	0.173660
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000051	0.100000	0.000041
		Tin and its compounds	Tin, metal	7440-31-5	0.051231	99.900000	0.040444
			Subtotal		0.051282	100.0000000	0.040484

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.049185
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.009837
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.019674
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.118044
			Subtotal		0.249213	100.0000000	0.196739
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.008273
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.008274
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.006435
			Subtotal		0.008152	100.0000000	0.006435
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001471
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.066193
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.005884
			Subtotal		0.093163	100.0000000	0.073547
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.018385
			Subtotal		0.023291	100.0000000	0.018387

Capacitor 7	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.044014	25.000000	0.034746
		Manganese and its compounds	Manganese oxide	1344-43-0	0.008803	5.000000	0.006949
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.017605	10.000000	0.013898
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.105633	60.000000	0.083391
			Subtotal		0.176055	100.0000000	0.138985
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.007319	99.900000	0.005778
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000006
			Subtotal		0.007326	100.0000000	0.005783
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000011	0.100000	0.000009
		Nickel and its compounds	Nickel, metal	7440-02-0	0.010978	99.900000	0.008667
			Subtotal		0.010989	100.0000000	0.008675
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002200	2.000000	0.001737
		Copper and its compounds	Copper, metal	7440-50-8	0.098990	90.000000	0.078147
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.008799	8.000000	0.006946
			Subtotal		0.109989	100.0000000	0.086830
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000026	0.100000	0.000020
		Tin and its compounds	Tin, metal	7440-31-5	0.025615	99.900000	0.020222
			Subtotal		0.025641	100.0000000	0.020242

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		4.891100	5.000000	3.861244
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	85.105140	87.000000	67.185653
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	2.934660	3.000000	2.316747
		Inorganic compounds	Carbon Black	1333-86-4	0.489110	0.500000	0.386124
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.097822	0.100000	0.077225
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.271686	1.300000	1.003923
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		2.934660	3.000000	2.316747
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.097822	0.100000	0.077225
			Subtotal		97.822000	100.0000000	77.224888

Epoxy Adhesive	Epoxy Adhesive	Anhydrides	Proprietary Material - Other anhydrides		0.028170	3.000000	0.022239
		Epoxy Resins	Proprietary Material-Other Epoxy resins		0.061035	6.500000	0.048184
		Organic Silicon compounds	(3,4-Epoxycyclohexyl)ethyltrimethoxysilane	3388-04-3	0.004695	0.500000	0.003706
		Silver and its compounds	Silver, metal	7440-22-4	0.845100	90.000000	0.667158
			Subtotal		0.939000	100.0000000	0.741287

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.205880	40.000000	0.162531
		Boron and its compounds	Boron oxide	1303-86-2	0.051470	10.000000	0.040633
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.257351	50.000000	0.203164
			Subtotal		0.514701	100.0000000	0.406327
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000103	0.100000	0.000081
		Silver and its compounds	Silver, metal	7440-22-4	0.102841	99.900000	0.081187
			Subtotal		0.102944	100.0000000	0.081268
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000034	0.100000	0.000027
		Nickel and its compounds	Nickel, metal	7440-02-0	0.033933	99.900000	0.026789
			Subtotal		0.033967	100.0000000	0.026815
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000139	0.100000	0.000110
		Silver and its compounds	Silver, metal	7440-22-4	0.138828	99.900000	0.109597
			Subtotal		0.138967	100.0000000	0.109707
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.001956	5.000000	0.001545
		Boron and its compounds	Boron oxide	1303-86-2	0.005869	15.000000	0.004634
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.001956	5.000000	0.001545
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.027391	70.000000	0.021624
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.001956	5.000000	0.001545
			Subtotal		0.039130	100.0000000	0.030891
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000045	0.100000	0.000036
		Tin and its compounds	Tin, metal	7440-31-5	0.045245	99.900000	0.035718
			Subtotal		0.045290	100.0000000	0.035754

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.032506
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.008127
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.040633
			Subtotal		0.102940	100.0000000	0.081265
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.016252
			Subtotal		0.020589	100.0000000	0.016254
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.005363
			Subtotal		0.006794	100.0000000	0.005363
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.021939
			Subtotal		0.027793	100.0000000	0.021941
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.000309
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.000927
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000309
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.004325
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.000309
			Subtotal		0.007826	100.0000000	0.006178
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.007150
			Subtotal		0.009058	100.0000000	0.007151

Resistor	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.109641	96.100000	0.086555
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000456	0.400000	0.000360
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001711	1.500000	0.001351
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.002282	2.000000	0.001801
			Subtotal		0.114090	100.0000000	0.090068
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000452	13.799000	0.000356
		Boron and its compounds	Boron oxide	1303-86-2	0.000039	1.200000	0.000031
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000151	4.608000	0.000119
		Silver and its compounds	Silver, metal	7440-22-4	0.002631	80.393000	0.002077
			Subtotal		0.003273	100.0000000	0.002584
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000196	4.500000	0.000155
		Boron and its compounds	Boron oxide	1303-86-2	0.000009	0.200000	0.000007
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000118	2.700000	0.000093
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000161	3.700000	0.000128
		Silver and its compounds	Silver, metal	7440-22-4	0.003879	88.900000	0.003062
			Subtotal		0.004364	100.0000000	0.003445
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000724	16.600000	0.000572
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000188	4.300000	0.000148
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.001091	25.000000	0.000861
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.002361	54.100000	0.001864
			Subtotal		0.004364	100.0000000	0.003445
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006545	99.990000	0.005167
			Subtotal		0.006546	100.0000000	0.005168
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000146	6.698000	0.000115
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.001647	75.476000	0.001300
		Boron and its compounds	Boron oxide	1303-86-2	0.000023	1.031000	0.000018
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000367	16.795000	0.000289
			Subtotal		0.002182	100.0000000	0.001723
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000300	5.501000	0.000237
		Boron and its compounds	Boron oxide	1303-86-2	0.000049	0.900000	0.000039
		Copper and its compounds	Cupric oxide	1317-38-0	0.000049	0.900000	0.000039
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001074	19.702000	0.000848
		Lead and its compounds	Lead monooxide	1317-36-8	0.000308	5.641000	0.000243
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000098	1.800000	0.000077
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000491	9.001000	0.000387
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000491	9.001000	0.000387
		Silver and its compounds	Silver, metal	7440-22-4	0.002343	42.954000	0.001849
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000153	2.800000	0.000121
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000098	1.800000	0.000077
			Subtotal		0.005454	100.0000000	0.004306
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	34.965000	0.000276
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.035000	0.000513
			Subtotal		0.001000	100.0000000	0.000789
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.008726	99.990000	0.006889
			Subtotal		0.008727	100.0000000	0.006889

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	8.509402	89.600000	6.717687
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.085474	0.900000	0.067477
		Nickel and its compounds	Nickel, metal	7440-02-0	0.047485	0.500000	0.037487
		Silver and its compounds	Silver, metal	7440-22-4	0.029916	0.315000	0.023617
		Tin and its compounds	Tin, metal	7440-31-5	0.824823	8.685000	0.651151
			Subtotal		9.497100	100.0000000	7.497419

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	8.509402	89.600000	6.717687
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.085474	0.900000	0.067477
		Nickel and its compounds	Nickel, metal	7440-02-0	0.047485	0.500000	0.037487
		Silver and its compounds	Silver, metal	7440-22-4	0.029916	0.315000	0.023617
		Tin and its compounds	Tin, metal	7440-31-5	0.824823	8.685000	0.651151
			Subtotal		9.497100	100.0000000	7.497419

Semiconductor Die 3	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.016766	1.020000	0.013236
		Inorganic Silicon compounds	Silicon	7440-21-3	1.594396	97.000400	1.258684
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.032539	1.979600	0.025687
			Subtotal		1.643700	100.0000000	1.297607

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.007845	0.500000	0.006193
		Silver and its compounds	Silver, metal	7440-22-4	0.047070	3.000000	0.037159
		Tin and its compounds	Tin, metal	7440-31-5	1.514085	96.500000	1.195284
			Subtotal		1.569000	100.0000000	1.238636

Substrate, Pre-plated NiPdAu	Copper Foil 1	Copper and its compounds	Copper, metal	7440-50-8	0.036643	99.990000	0.028927
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.010000	0.000003
			Subtotal		0.036646	100.0000000	0.028930
	Copper Foil 2	Copper and its compounds	Copper, metal	7440-50-8	0.009161	99.990000	0.007232
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009162	100.0000000	0.007233
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	0.425523	99.990000	0.335926
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000043	0.010000	0.000034
			Subtotal		0.425565	100.0000000	0.335960
	Gold Plating	Gold and its compounds	Gold, metal	7440-57-5	0.004505	99.990000	0.003557
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.004506	100.0000000	0.003557
	Solder Mask	Barium and its compounds	Barium sulfate	7727-43-7	0.008258	19.600000	0.006519
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004213	10.000000	0.003326
		Magnesium and its compounds	Talc	14807-96-6	0.001264	3.000000	0.000998
		Organic compounds	Other organic compounds.		0.002402	5.700000	0.001896
		Polymers	Plastic: EP - Epoxide, Epoxy		0.005309	12.600000	0.004191
		Polymers	Plastic: PAK		0.020687	49.100000	0.016331
			Subtotal		0.042133	100.0000000	0.033261
	Substrate Core	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.110857	23.000000	0.087516
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.218823	45.400000	0.172748
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.040005	8.300000	0.031582
		Polymers	BT Resin (CAS# 13676-54-5/25722-66-1)		0.112303	23.300000	0.088657
			Subtotal		0.481988	100.0000000	0.380503

			Total		126.671598	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G37E38T2 Product content declaration of AFSC5G37E38T2		上次修订 Last Revision (GMT): Monday, 13 May 2024, 08:17:00 PM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 7	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	铜箔 Copper Foil 1	O	O	O	O	O	O
	铜箔 Copper Foil 2	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O
	镀金材料 Gold Plating	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O
	有机基质芯 Substrate Core	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G37E38T2		Last Revision (GMT): Monday, 13 May 2024, 08:17:00 PM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 6	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 7	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 21 Oct 2023	Test Report 21 Oct 2023	Test Report 21 Oct 2023	Not Available
Inductor 1	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Inductor 2	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Resistor	1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	ALUMINA SUBSTRATE	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Semiconductor Die 1	AU BUMPING	Not Available	Not Available	Not Available	Not Available
	DIE	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 2	AU BUMPING	Not Available	Not Available	Not Available	Not Available
	DIE	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 3		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated NiPdAu		Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer