AFSC5G37D37T2

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

European RoHS

Chinese RoHS

NXP Semiconductors
Product content declaration of AFSC5G37D37T2		Last Revision (GMT): Wednesday, 12 June 2024, 07:07:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G37D37T2	SOT1831	HLLGA27	182.145880 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Not Applicable	Other	Not Applicable	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9353 777 67528	2023-11-24	12	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.397540	99.990000	0.218254
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000040	0.010000	0.000022
			Subtotal		0.397580	100.0000000	0.218276

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.023341	25.000000	0.012814
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004668	5.000000	0.002563
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009336	10.000000	0.005126
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.056017	60.000000	0.030754
			Subtotal		0.093363	100.0000000	0.051257
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003881	99.900000	0.002131
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000002
			Subtotal		0.003885	100.0000000	0.002133
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005822	99.900000	0.003196
			Subtotal		0.005828	100.0000000	0.003199
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001167	2.000000	0.000640
		Copper and its compounds	Copper, metal	7440-50-8	0.052495	90.000000	0.028820
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004666	8.000000	0.002562
			Subtotal		0.058327	100.0000000	0.032022
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000008
		Tin and its compounds	Tin, metal	7440-31-5	0.013584	99.900000	0.007458
			Subtotal		0.013598	100.0000000	0.007465

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.006590
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.001318
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.002636
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.015816
			Subtotal		0.048015	100.0000000	0.026361
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001096
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000001
			Subtotal		0.001998	100.0000000	0.001097
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.001644
			Subtotal		0.002997	100.0000000	0.001645
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000329
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.014822
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001318
			Subtotal		0.029997	100.0000000	0.016469
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.003835
			Subtotal		0.006993	100.0000000	0.003839

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.006590
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.001318
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.002636
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.015816
			Subtotal		0.048015	100.0000000	0.026361
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001096
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000001
			Subtotal		0.001998	100.0000000	0.001097
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.001644
			Subtotal		0.002997	100.0000000	0.001645
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000329
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.014822
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001318
			Subtotal		0.029997	100.0000000	0.016469
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.003835
			Subtotal		0.006993	100.0000000	0.003839

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.014591	25.000000	0.008011
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002918	5.000000	0.001602
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005836	10.000000	0.003204
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.035018	60.000000	0.019225
			Subtotal		0.058364	100.0000000	0.032042
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.002454	99.990000	0.001347
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.002455	100.0000000	0.001348
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001908	99.990000	0.001048
			Subtotal		0.001909	100.0000000	0.001048
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000436	2.000000	0.000240
		Copper and its compounds	Copper, metal	7440-50-8	0.019636	90.000000	0.010781
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001746	8.000000	0.000958
			Subtotal		0.021818	100.0000000	0.011978
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.005454	99.990000	0.002994
			Subtotal		0.005455	100.0000000	0.002995

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.014591	25.000000	0.008011
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002918	5.000000	0.001602
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005836	10.000000	0.003204
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.035018	60.000000	0.019225
			Subtotal		0.058364	100.0000000	0.032042
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.002454	99.990000	0.001347
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.002455	100.0000000	0.001348
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001908	99.990000	0.001048
			Subtotal		0.001909	100.0000000	0.001048
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000436	2.000000	0.000240
		Copper and its compounds	Copper, metal	7440-50-8	0.019636	90.000000	0.010781
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001746	8.000000	0.000958
			Subtotal		0.021818	100.0000000	0.011978
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.005454	99.990000	0.002994
			Subtotal		0.005455	100.0000000	0.002995

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		5.710600	5.000000	3.135179
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	99.364440	87.000000	54.552121
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	3.426360	3.000000	1.881108
		Inorganic compounds	Carbon Black	1333-86-4	0.571060	0.500000	0.313518
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.114212	0.100000	0.062704
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.484756	1.300000	0.815147
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		3.426360	3.000000	1.881108
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.114212	0.100000	0.062704
			Subtotal		114.212000	100.0000000	62.703587

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.031836	3.061200	0.017479
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.031836	3.061200	0.017479
		Silver and its compounds	Silver, metal	7440-22-4	0.976327	93.877600	0.536014
			Subtotal		1.040000	100.0000000	0.570971

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.018824	40.000000	0.010334
		Boron and its compounds	Boron oxide	1303-86-2	0.004706	10.000000	0.002584
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.023530	50.000000	0.012918
			Subtotal		0.047059	100.0000000	0.025836
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000179	5.000000	0.000098
		Boron and its compounds	Boron oxide	1303-86-2	0.000536	15.000000	0.000295
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000179	5.000000	0.000098
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002504	70.000000	0.001375
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000179	5.000000	0.000098
			Subtotal		0.003577	100.0000000	0.001964
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000009	0.100000	0.000005
		Silver and its compounds	Silver, metal	7440-22-4	0.009403	99.900000	0.005162
			Subtotal		0.009412	100.0000000	0.005167
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003102	99.900000	0.001703
			Subtotal		0.003106	100.0000000	0.001705
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000013	0.100000	0.000007
		Silver and its compounds	Silver, metal	7440-22-4	0.012693	99.900000	0.006968
			Subtotal		0.012706	100.0000000	0.006975
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.004137	99.900000	0.002271
			Subtotal		0.004141	100.0000000	0.002273

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.035294	40.000000	0.019377
		Boron and its compounds	Boron oxide	1303-86-2	0.008823	10.000000	0.004844
		Inorganic Silicon compounds	Quartz	14808-60-7	0.044117	50.000000	0.024221
			Subtotal		0.088234	100.0000000	0.048442
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.017646	99.990000	0.009688
			Subtotal		0.017647	100.0000000	0.009689
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005822	99.990000	0.003197
			Subtotal		0.005823	100.0000000	0.003197
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.023821	99.990000	0.013078
			Subtotal		0.023823	100.0000000	0.013079
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000335	5.000000	0.000184
		Boron and its compounds	Boron oxide	1303-86-2	0.001006	15.000000	0.000552
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000335	5.000000	0.000184
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004696	70.000000	0.002578
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000335	5.000000	0.000184
			Subtotal		0.006708	100.0000000	0.003683
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.007763	99.990000	0.004262
			Subtotal		0.007764	100.0000000	0.004262

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.035294	40.000000	0.019377
		Boron and its compounds	Boron oxide	1303-86-2	0.008823	10.000000	0.004844
		Inorganic Silicon compounds	Quartz	14808-60-7	0.044117	50.000000	0.024221
			Subtotal		0.088234	100.0000000	0.048442
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.017646	99.990000	0.009688
			Subtotal		0.017647	100.0000000	0.009689
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005822	99.990000	0.003197
			Subtotal		0.005823	100.0000000	0.003197
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.023821	99.990000	0.013078
			Subtotal		0.023823	100.0000000	0.013079
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000335	5.000000	0.000184
		Boron and its compounds	Boron oxide	1303-86-2	0.001006	15.000000	0.000552
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000335	5.000000	0.000184
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004696	70.000000	0.002578
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000335	5.000000	0.000184
			Subtotal		0.006708	100.0000000	0.003683
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.007763	99.990000	0.004262
			Subtotal		0.007764	100.0000000	0.004262

Inductor 4	Inductor	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.043400	24.800000	0.023827
		Boron and its compounds	Boron oxide	1303-86-2	0.011900	6.800000	0.006533
		Cobalt and its compounds	C.I. Pigment Blue 28	1345-16-0	0.000700	0.400000	0.000384
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.061600	35.200000	0.033819
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008400	4.800000	0.004612
		Silver and its compounds	Silver, metal	7440-22-4	0.038150	21.800000	0.020945
		Tin and its compounds	Tin, metal	7440-31-5	0.010850	6.200000	0.005957
			Subtotal		0.175000	100.0000000	0.096077

Resistor 1	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.023154	96.100000	0.012712
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000096	0.400000	0.000053
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000361	1.500000	0.000198
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000482	2.000000	0.000264
			Subtotal		0.024093	100.0000000	0.013227
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000076
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000007
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000025
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.000441
			Subtotal		0.001000	100.0000000	0.000549
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000025
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000001
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000015
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000020
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.000488
			Subtotal		0.001000	100.0000000	0.000549
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000091
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000024
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000250	25.000000	0.000137
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.000541	54.100000	0.000297
			Subtotal		0.001000	100.0000000	0.000549
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001729	99.990000	0.000950
			Subtotal		0.001730	100.0000000	0.000950
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000037
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.000414
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000005
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000092
			Subtotal		0.001000	100.0000000	0.000549
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000072	5.510000	0.000040
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	0.900000	0.000006
		Copper and its compounds	Cupric oxide	1317-38-0	0.000012	0.900000	0.000006
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000257	19.540000	0.000141
		Lead and its compounds	Lead monooxide	1317-36-8	0.000074	5.650000	0.000041
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000024	1.800000	0.000013
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000118	9.020000	0.000065
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000118	9.020000	0.000065
		Silver and its compounds	Silver, metal	7440-22-4	0.000565	43.050000	0.000310
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000037	2.810000	0.000020
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000024	1.800000	0.000013
			Subtotal		0.001313	100.0000000	0.000721
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000192
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000357
			Subtotal		0.001000	100.0000000	0.000549
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.002593	99.990000	0.001424
			Subtotal		0.002594	100.0000000	0.001424

Resistor 2	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000076
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000007
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000025
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.000441
			Subtotal		0.001000	100.0000000	0.000549
	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.023153	96.100000	0.012711
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000096	0.400000	0.000053
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000361	1.500000	0.000198
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000482	2.000000	0.000264
			Subtotal		0.024092	100.0000000	0.013227
	Conductor	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000192
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000357
			Subtotal		0.001000	100.0000000	0.000549
	Insulation	Chromium and Chromium III compounds	C.I. Pigment Black 28	68186-91-4	0.000050	5.000000	0.000028
		Epoxy Resins	Epikote 862	28064-14-4	0.000741	74.100000	0.000407
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000091
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000024
			Subtotal		0.001000	100.0000000	0.000549
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000037
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.000414
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000005
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000092
			Subtotal		0.001000	100.0000000	0.000549
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000072	5.500000	0.000039
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	0.900000	0.000006
		Copper and its compounds	Cupric oxide	1317-38-0	0.000012	0.900000	0.000006
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000256	19.523000	0.000140
		Lead and its compounds	Lead monooxide	1317-36-8	0.000074	5.674000	0.000041
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000024	1.800000	0.000013
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000118	9.000000	0.000065
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000118	9.000000	0.000065
		Silver and its compounds	Silver, metal	7440-22-4	0.000564	43.103000	0.000310
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000037	2.800000	0.000020
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000024	1.800000	0.000013
			Subtotal		0.001310	100.0000000	0.000719
	Termination	Nickel and its compounds	Nickel, metal	7440-02-0	0.001731	40.000000	0.000950
		Tin and its compounds	Tin, metal	7440-31-5	0.002597	60.000000	0.001426
			Subtotal		0.004328	100.0000000	0.002376
	Top Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000025
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000001
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000015
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000020
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.000488
			Subtotal		0.001000	100.0000000	0.000549

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	17.018803	89.600000	9.343502
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.170948	0.900000	0.093852
		Nickel and its compounds	Nickel, metal	7440-02-0	0.094971	0.500000	0.052140
		Silver and its compounds	Silver, metal	7440-22-4	0.059832	0.315000	0.032848
		Tin and its compounds	Tin, metal	7440-31-5	1.649646	8.685000	0.905673
			Subtotal		18.994200	100.0000000	10.428015

Semiconductor Die 2	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.002775	1.020000	0.001524
		Inorganic Silicon compounds	Silicon, doped		0.263919	97.000400	0.144894
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005386	1.979600	0.002957
			Subtotal		0.272080	100.0000000	0.149375

Semiconductor Die 3	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.005514	1.020000	0.003027
		Inorganic Silicon compounds	Silicon, doped		0.524345	97.000400	0.287871
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.010701	1.979600	0.005875
			Subtotal		0.540560	100.0000000	0.296773

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.018850	0.500000	0.010349
		Silver and its compounds	Silver, metal	7440-22-4	0.113100	3.000000	0.062093
		Tin and its compounds	Tin, metal	7440-31-5	3.638050	96.500000	1.997328
			Subtotal		3.770000	100.0000000	2.069770

Substrate	Substrate	Copper and its compounds	Copper, metal	7440-50-8	12.528000	30.000000	6.878004
		Epoxy Resins	Proprietary Material-Other Epoxy resins		12.945600	31.000000	7.107270
		Gold and its compounds	Gold, metal	7440-57-5	0.417600	1.000000	0.229267
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	12.528000	30.000000	6.878004
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		2.088000	5.000000	1.146334
		Nickel and its compounds	Nickel, metal	7440-02-0	1.252800	3.000000	0.687800
			Subtotal		41.760000	100.0000000	22.926678

			Total		182.145880	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G37D37T2 Product content declaration of AFSC5G37D37T2		上次修订 Last Revision (GMT): Wednesday, 12 June 2024, 07:07:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	电感 Inductor	O	O	O	O	O	O
电阻 Resistor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 2	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	顶部电导体 Top Conductor	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板 Substrate	基板 Substrate	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G37D37T2		Last Revision (GMT): Wednesday, 12 June 2024, 07:07:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 13 Jul 2023	Test Report 13 Jul 2023	Test Report 13 Jul 2023	Test Report 13 Jul 2023
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023
Inductor 1	ELECTRODE	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Inductor 2	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Inductor 3	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Inductor 4	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021	Test Report 25 Jun 2021
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Resistor 1	ALUMINA	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2020	Test Report 6 Nov 2020	Test Report 6 Nov 2020	Test Report 6 Nov 2020
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Resistor 2	ALUMINA	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Semiconductor Die 1	AU BUMPING	Not Available	Not Available	Not Available	Not Available
	DIE	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 2	AU BUMPING	Not Available	Not Available	Not Available	Not Available
	DIE	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 3		Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate		Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer