| ID and Description |
Vendor ID |
Format |
Size K |
Rev # |
Date Last Modified |
| AN923 — 800 MHz Test Fixture Design Application Note |
NXP |
pdf |
183 |
0 |
7/20/1993 |
| AN1617 — Mounting Recommendations for Copper Tungsten Flanged Transistors Application Note |
NXP |
pdf |
82 |
0 |
3/19/1997 |
| AN1643 — RF LDMOS Power Modules for GSM Base Station Application: Optimum Biasing Current - Application Note |
NXP |
pdf |
88 |
0 |
1/31/1998 |
| AN1907 — AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages |
NXP |
pdf |
889 |
3 |
5/13/2009 |
| AN1908 — AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages |
NXP |
pdf |
649 |
1 |
2/24/2011 |
| AN1923 — Mounting Method with Mechanical Fasteners for the MRF19090 and Similar Packages Application Note |
NXP |
pdf |
466 |
0 |
4/10/2001 |
| AN1949 — Mounting Method for the MHVIC910HR2 PFP-16 and Similar Surface Mount Packages Application Note |
NXP |
pdf |
595 |
0 |
2/05/2003 |
| AN1977 — Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 |
NXP |
pdf |
110 |
0 |
10/09/2003 |
| AN1987 — Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 |
NXP |
pdf |
108 |
1 |
5/12/2004 |
| AN3263 — Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages |
NXP |
pdf |
8024 |
0 |
6/07/2006 |
| AN3789 — Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages |
NXP |
pdf |
403 |
0 |
3/12/2009 |
| AN4005 — Thermal Management and Mounting Method for the PLD 1.5 RF Power Surface Mount Package Application Note |
NXP |
pdf |
111 |
0 |
11/14/1997 |