| ID and Description | Vendor ID | Format | Size K | Rev # | Date Last Modified | Download Code Files |
| AN1907 — AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages | NXP | 889 | 3 | 5/13/2009 | ||
| AN3263 — Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages | NXP | 8024 | 0 | 6/07/2006 |