| ID and Description |
Vendor ID |
Format |
Size K |
Rev # |
Date Last Modified |
| AN1530 — Advanced Amplifier Concept Package Application Note |
NXP |
pdf |
187 |
0 |
12/31/1994 |
| AN1643 — RF LDMOS Power Modules for GSM Base Station Application: Optimum Biasing Current - Application Note |
NXP |
pdf |
88 |
0 |
1/31/1998 |
| AN1670 — 60 Watts, GSM 900 MHz, LDMOS Two-Stage Amplifier Application Note |
NXP |
pdf |
816 |
0 |
9/14/1998 |
| AN1907 — AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages |
NXP |
pdf |
889 |
3 |
5/13/2009 |
| AN1908 — AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages |
NXP |
pdf |
649 |
1 |
2/24/2011 |
| AN1923 — Mounting Method with Mechanical Fasteners for the MRF19090 and Similar Packages Application Note |
NXP |
pdf |
466 |
0 |
4/10/2001 |
| AN1938 — Sensitivity of High Power RF Transistors to Source and Output Loads Application Note |
NXP |
pdf |
253 |
1 |
12/03/2001 |
| AN1949 — Mounting Method for the MHVIC910HR2 PFP-16 and Similar Surface Mount Packages Application Note |
NXP |
pdf |
595 |
0 |
2/05/2003 |
| AN1977 — Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 |
NXP |
pdf |
110 |
0 |
10/09/2003 |
| AN1987 — Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 |
NXP |
pdf |
108 |
1 |
5/12/2004 |
| AN3263 — Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages |
NXP |
pdf |
8024 |
0 |
6/07/2006 |
| AN4005 — Thermal Management and Mounting Method for the PLD 1.5 RF Power Surface Mount Package Application Note |
NXP |
pdf |
111 |
0 |
11/14/1997 |
| AN423 — Field Effect Transistor RF Amplifier Design Techniques Application Note |
NXP |
pdf |
104 |
0 |
12/31/1993 |