部分 | 封装 | 物质声明 | 安全保障/功能安全 | 湿度灵敏度等级(MSL) | Peak Package Body Temperature(PPT)(℃) | Maximum Time at Peak Temperature(s) | |||
---|---|---|---|---|---|---|---|---|---|
无铅焊接 | 无铅焊接 | 无铅焊接 | |||||||
MK64FX512VMD12 封装 : LBGA144 |
MK64FX512VMD12 (935324731557) |
No | 3 | 260 | 40 | ||||
MK64FX512VLQ12 封装 : LQFP144 |
MK64FX512VLQ12 (935315204557) |
No | 3 | 260 | 40 | ||||
MK64FX512VLL12 封装 : LQFP100 |
MK64FX512VLL12 (935315192557) |
No | 3 | 260 | 40 | ||||
MK64FX512VDC12 封装 : XFBGA121 |
MK64FX512VDC12 (935323475557) |
No | 3 | 260 | 40 | ||||
MK64FN1M0VMD12 封装 : LBGA144 |
MK64FN1M0VMD12 (935315206557) |
No | 3 | 260 | 40 | ||||
MK64FN1M0VLQ12 封装 : LQFP144 |
MK64FN1M0VLQ12 (935324728557) |
No | 3 | 260 | 40 | ||||
MK64FN1M0VLL12 封装 : LQFP100 |
MK64FN1M0VLL12 (935315207557) |
No | 3 | 260 | 40 | ||||
MK64FN1M0VLL12R (935315207528) |
No | 3 | 260 | 40 | |||||
MK64FN1M0VDC12 封装 : XFBGA121 |
MK64FN1M0VDC12 (935318682557) |
No | 3 | 260 | 40 | ||||
MK64FN1M0CAJ12 |
MK64FN1M0CAJ12R (935323594051) |
No | 1 | 260 | 40 |