汽车无线电数字信号处理器(DSP) | NXP 半导体

汽车无线电数字信号处理器(DSP)

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N true 0 PSPSAF7741HVzh 1 封装信息 Package Information t790 1 zh zh zh 封装信息 Package Information 1 1 1.0 English 1455079211579695758412 PSP 865.0 KB None None documents None 1455079211579695758412 /docs/en/package-information/SOT612-3.pdf 865042 /docs/en/package-information/SOT612-3.pdf SOT612-3 documents N N 2016-02-12 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad /docs/en/package-information/SOT612-3.pdf /docs/en/package-information/SOT612-3.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Jun 8, 2016 302435339416912908 Package Information Y N plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad false 0 SAF7741HV downloads zh-Hans true 1 Y PSP 封装信息 1 /docs/en/package-information/SOT612-3.pdf 2016-02-12 1455079211579695758412 PSP 1 Jun 8, 2016 Package Information None /docs/en/package-information/SOT612-3.pdf English documents 865042 None 302435339416912908 2022-12-07 N /docs/en/package-information/SOT612-3.pdf plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad /docs/en/package-information/SOT612-3.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N N plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad 865.0 KB SOT612-3 N 1455079211579695758412 true Y Products

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