8 W BTL或2 × 4 W SE功率 | NXP 半导体

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8 W BTL或2 × 4 W SE功率

TDA1517ATW
停产
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滚动图片以放大

TDA1517ATW采用塑料热沉超薄紧缩小型封装(HTSSOP20)的集成式AB类输出放大器。该器件主要为多媒体应用而开发。

购买/参数

1 结果

不包含 1 不推荐用于新设计

部件

展开描述

计算机辅助设计模型

封装类型

状态

Po (W)

Output configuration

Speaker impedance (BTL / SE)

Input format

VP [min - max] (V)

类型

Power Down

TDA1517ATW
数据手册

HTSSOP20

停产

8

SE / BTL

4; 8

Analog

8.5 - 18

AB

Yes

N true 0 PSPTDA1517ATWzh 3 包装信息 Packing Information t935 1 封装信息 Package Information t790 1 数据手册 Data Sheet t520 1 zh zh zh 数据手册 Data Sheet 1 1 2.1 English 1442068822619714745445 PSP 489.0 KB None None documents None 1442068822619714745445 /docs/en/data-sheet/TDA1517ATW.pdf 489000 /docs/en/data-sheet/TDA1517ATW.pdf TDA1517ATW documents N 2015-09-12 8 W BTL or 2 × 4 W SE power /docs/en/data-sheet/TDA1517ATW.pdf /docs/en/data-sheet/TDA1517ATW.pdf Data Sheet N 980000996212993340 2022-12-07 pdf en Jul 23, 2010 980000996212993340 Data Sheet Y N 8 W BTL or 2 × 4 W SE power 封装信息 Package Information 1 2 1.1 English 1455079539042709987269 PSP 423.4 KB None None documents None 1455079539042709987269 /docs/en/package-information/SOT527-1.pdf 423357 /docs/en/package-information/SOT527-1.pdf SOT527-1 documents N N 2018-05-25 plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad /docs/en/package-information/SOT527-1.pdf /docs/en/package-information/SOT527-1.pdf Package Information N 302435339416912908 2022-12-07 pdf N en May 25, 2018 302435339416912908 Package Information Y N plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad 包装信息 Packing Information 1 3 1.0 English 1442131686625724214299 PSP 186.0 KB None None documents None 1442131686625724214299 /docs/en/packing/SOT527-1_118.pdf 186000 /docs/en/packing/SOT527-1_118.pdf SOT527-1_118 documents N 2015-09-13 HTSSOP20; reel pack; standard product orientation 12NC
ending 118 /docs/en/packing/SOT527-1_118.pdf /docs/en/packing/SOT527-1_118.pdf Packing Information N 145666923842250347 2022-12-07 pdf en Nov 7, 2013 145666923842250347 Packing Information Y N HTSSOP20; reel pack; standard product orientation 12NC
ending 118 false 0 TDA1517ATW downloads zh-Hans true 1 Y PSP 包装信息 1 /docs/en/packing/SOT527-1_118.pdf 2015-09-13 1442131686625724214299 PSP 3 Nov 7, 2013 Packing Information None /docs/en/packing/SOT527-1_118.pdf English documents 186000 None 145666923842250347 2022-12-07 /docs/en/packing/SOT527-1_118.pdf HTSSOP20; reel pack; standard product orientation 12NC
ending 118 /docs/en/packing/SOT527-1_118.pdf documents 145666923842250347 Packing Information N en None Y pdf 1.0 N HTSSOP20; reel pack; standard product orientation 12NC
ending 118 186.0 KB SOT527-1_118 N 1442131686625724214299 封装信息 1 /docs/en/package-information/SOT527-1.pdf 2018-05-25 1455079539042709987269 PSP 2 May 25, 2018 Package Information None /docs/en/package-information/SOT527-1.pdf English documents 423357 None 302435339416912908 2022-12-07 N /docs/en/package-information/SOT527-1.pdf plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad /docs/en/package-information/SOT527-1.pdf documents 302435339416912908 Package Information N en None Y pdf 1.1 N N plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad 423.4 KB SOT527-1 N 1455079539042709987269 数据手册 1 /docs/en/data-sheet/TDA1517ATW.pdf 2015-09-12 1442068822619714745445 PSP 1 Jul 23, 2010 Data Sheet None /docs/en/data-sheet/TDA1517ATW.pdf English documents 489000 None 980000996212993340 2022-12-07 /docs/en/data-sheet/TDA1517ATW.pdf 8 W BTL or 2 × 4 W SE power /docs/en/data-sheet/TDA1517ATW.pdf documents 980000996212993340 Data Sheet N en None Y pdf 2.1 N 8 W BTL or 2 × 4 W SE power 489.0 KB TDA1517ATW N 1442068822619714745445 true Y Products

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