MRF24G300HS_300 W CW, 2400-2500 MHz, 50 V | NXP 半导体

300 W CW over 2400-2500 MHz, 50 V RF Power GaN Transistor

  • 本页面包含有关样品阶段产品的信息。此处的规格和信息如有更改,恕不另行通知。如需了解其他信息,请联系支持人员或您的销售代表。

滚动图片以放大

产品详情

特征

  • Advanced GaN on SiC, for optimal thermal performance
  • Characterized for CW, long pulse (up to several seconds) and short pulse operations
  • Device can be used in a single-ended or push-pull configuration
  • Input matched for simplified input circuitry
  • 适用于55 V电压
  • 适合线性应用
  • 符合RoHS规范
  • 工业加热
  • Welding and heat sealing
  • 等离子生成
  • 照明
  • Scientific instrumentation
  • 医疗
    • 微波消融
    • 透热疗法

射频性能表

负载不匹配/耐用性

频率
(MHz)
信号类型 VSWR 输入功率
(W)
测试
电压
结果
2450脉冲
(100 µsec,20%占空比)
> 20:1
at All Phase Angles
12.6 Peak55无设备退化

典型性能

In 2400-2500 MHz MRF24G300HS reference circuit, VDD = 48 Vdc, VGS(A+B) = –5 Vdc (1)
频率
(MHz)
信号类型 输入功率
(W)
输出功率
(W)
Gps
(dB)
ηD
(%)
2400连续波10.033615.370.4
245010.033215.273.0
250010.030714.974.4
1. 所有数据均在一个装置中测量,设备焊接到散热器上。

购买/参数










































































































N true 0 PSPMRF24G300HSzh 5 封装信息 Package Information t790 2 工程设计要点 Technical Notes t521 1 应用笔记 Application Note t789 1 数据手册 Data Sheet t520 1 zh zh zh 数据手册 Data Sheet 1 1 0 English MRF24G300HS, MRF24G300H 300 W CW over 2400-2500 MHz, 50 V RF power GaN transistor for industrial, scientific, medical (ISM) applications at 2450 MHz. 1570146481833740755502 PSP 265.8 KB None None documents None 1570146481833740755502 /docs/en/data-sheet/MRF24G300HS.pdf 265806 /docs/en/data-sheet/MRF24G300HS.pdf MRF24G300HS documents N N 2019-10-03 ARCHIVED - MRF24G300HS 300 W CW, 2400-2500 MHz, 50 V Data Sheet /docs/en/data-sheet/MRF24G300HS.pdf /docs/en/data-sheet/MRF24G300HS.pdf Data Sheet N 980000996212993340 2024-02-14 pdf N en Sep 23, 2019 980000996212993340 Data Sheet Y N ARCHIVED - MRF24G300HS 300 W CW, 2400-2500 MHz, 50 V Data Sheet 应用笔记 Application Note 1 2 1 English The purpose of this application note is to provide NXP Semiconductors customers with a guideline for solder reflow mounting of high power RF transistors and integrated circuits in Air Cavity Packages (ACP). S989356392744 PSP 664.6 KB None None documents None S989356392744 /docs/en/application-note/AN1908.pdf 664592 /docs/en/application-note/AN1908.pdf AN1908 documents N N 2016-10-31 AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages /docs/en/application-note/AN1908.pdf /docs/en/application-note/AN1908.pdf Application Note N 645036621402383989 2024-03-13 pdf N en Feb 24, 2011 645036621402383989 Application Note Y N AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages 工程设计要点 Technical Notes 1 3 0 English This document explains the format used by NXP<sup>&#174;</sup> for presenting LDMOS impedance information for both single-ended and push-pull devices on RF Power datasheets. 1074535848819727693421 PSP 171.0 KB None None documents None 1074535848819727693421 /docs/en/engineering-bulletin/EB212.pdf 170979 /docs/en/engineering-bulletin/EB212.pdf EB212 documents N N 2016-11-09 Using Data Sheet Impedances for RF LDMOS Devices /docs/en/engineering-bulletin/EB212.pdf /docs/en/engineering-bulletin/EB212.pdf Technical Notes N 389245547230346745 2024-09-13 pdf N en Jan 19, 2004 389245547230346745 Technical Notes Y N Using Data Sheet Impedances for RF LDMOS Devices 封装信息 Package Information 2 4 C English 98ASA10718D, 465H-02, NI-780S-4L 1145376001821716037786 PSP 42.9 KB None None documents None 1145376001821716037786 /docs/en/package-information/98ASA10718D.pdf 42869 /docs/en/package-information/98ASA10718D.pdf 98ASA10718D documents N N 2016-10-31 NI-780S-4L /docs/en/package-information/98ASA10718D.pdf /docs/en/package-information/98ASA10718D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Aug 15, 2016 302435339416912908 Package Information D N NI-780S-4L 5 A English 98ASA10793D, 465M-01, NI 780H-4L 1177631115779705085440 PSP 47.9 KB None None documents None 1177631115779705085440 /docs/en/package-information/98ASA10793D.pdf 47948 /docs/en/package-information/98ASA10793D.pdf SOT1827-1 documents N N 2016-10-31 98ASA10793D, NI-780H-4L /docs/en/package-information/98ASA10793D.pdf /docs/en/package-information/98ASA10793D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Mar 21, 2016 302435339416912908 Package Information D N 98ASA10793D, NI-780H-4L false 0 MRF24G300HS downloads zh-Hans true 1 Y PSP 封装信息 2 /docs/en/package-information/98ASA10718D.pdf 2016-10-31 1145376001821716037786 PSP 4 Aug 15, 2016 Package Information 98ASA10718D, 465H-02, NI-780S-4L None /docs/en/package-information/98ASA10718D.pdf English documents 42869 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA10718D.pdf NI-780S-4L /docs/en/package-information/98ASA10718D.pdf documents 302435339416912908 Package Information N en None D pdf C N N NI-780S-4L 42.9 KB 98ASA10718D N 1145376001821716037786 /docs/en/package-information/98ASA10793D.pdf 2016-10-31 1177631115779705085440 PSP 5 Mar 21, 2016 Package Information 98ASA10793D, 465M-01, NI 780H-4L None /docs/en/package-information/98ASA10793D.pdf English documents 47948 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA10793D.pdf 98ASA10793D, NI-780H-4L /docs/en/package-information/98ASA10793D.pdf documents 302435339416912908 Package Information N en None D pdf A N N 98ASA10793D, NI-780H-4L 47.9 KB SOT1827-1 N 1177631115779705085440 工程设计要点 1 /docs/en/engineering-bulletin/EB212.pdf 2016-11-09 1074535848819727693421 PSP 3 Jan 19, 2004 Technical Notes This document explains the format used by NXP<sup>&#174;</sup> for presenting LDMOS impedance information for both single-ended and push-pull devices on RF Power datasheets. None /docs/en/engineering-bulletin/EB212.pdf English documents 170979 None 389245547230346745 2024-09-13 N /docs/en/engineering-bulletin/EB212.pdf Using Data Sheet Impedances for RF LDMOS Devices /docs/en/engineering-bulletin/EB212.pdf documents 389245547230346745 Technical Notes N en None Y pdf 0 N N Using Data Sheet Impedances for RF LDMOS Devices 171.0 KB EB212 N 1074535848819727693421 应用笔记 1 /docs/en/application-note/AN1908.pdf 2016-10-31 S989356392744 PSP 2 Feb 24, 2011 Application Note The purpose of this application note is to provide NXP Semiconductors customers with a guideline for solder reflow mounting of high power RF transistors and integrated circuits in Air Cavity Packages (ACP). None /docs/en/application-note/AN1908.pdf English documents 664592 None 645036621402383989 2024-03-13 N /docs/en/application-note/AN1908.pdf AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages /docs/en/application-note/AN1908.pdf documents 645036621402383989 Application Note N en None Y pdf 1 N N AN1908 - Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages 664.6 KB AN1908 N S989356392744 数据手册 1 /docs/en/data-sheet/MRF24G300HS.pdf 2019-10-03 1570146481833740755502 PSP 1 Sep 23, 2019 Data Sheet MRF24G300HS, MRF24G300H 300 W CW over 2400-2500 MHz, 50 V RF power GaN transistor for industrial, scientific, medical (ISM) applications at 2450 MHz. None /docs/en/data-sheet/MRF24G300HS.pdf English documents 265806 None 980000996212993340 2024-02-14 N /docs/en/data-sheet/MRF24G300HS.pdf ARCHIVED - MRF24G300HS 300 W CW, 2400-2500 MHz, 50 V Data Sheet /docs/en/data-sheet/MRF24G300HS.pdf documents 980000996212993340 Data Sheet N en None Y pdf 0 N N ARCHIVED - MRF24G300HS 300 W CW, 2400-2500 MHz, 50 V Data Sheet 265.8 KB MRF24G300HS N 1570146481833740755502 true Y Products

文档

快速参考恩智浦 文档类别.

5 文件

紧凑列表

封装信息 (2)
工程设计要点 (1)
应用笔记 (1)
数据手册 (1)

设计文件

快速参考恩智浦 设计文件类型.

2 设计文件

支持

您需要什么帮助?

近期查看的产品

There are no recently viewed products to display.

查看或编辑浏览历史