封装信息 (2) 98ASA10575D, TO, 23.0x8.0x2.59, Pitch 12.0, 4 Pins[SOT1735-1] PDFMar 17, 2016版本更新 F 98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins[SOT1736-1] PDFJan 18, 2016版本更新 F 应用笔记 (3) AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages[AN1907] PDFMay 13, 2009版本更新 3 Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages[AN3789] PDFMar 12, 2009版本更新 0 Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages[AN3263] PDFJun 7, 2006版本更新 0 数据手册 (1) MRF6S19060NR1, MRF6S19060NBR1 1930-1990 MHz, 12 W Avg., 28 V, 2 x N-CDMA Lateral N-Channel RF Power MOSFETs[MRF6S19060N] PDFDec 27, 2010版本更新 5 该选项下未搜到结果。
封装信息 (2) 98ASA10575D, TO, 23.0x8.0x2.59, Pitch 12.0, 4 Pins[SOT1735-1] PDFMar 17, 2016版本更新 F 98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins[SOT1736-1] PDFJan 18, 2016版本更新 F 应用笔记 (3) AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages[AN1907] PDFMay 13, 2009版本更新 3 Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages[AN3789] PDFMar 12, 2009版本更新 0 Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages[AN3263] PDFJun 7, 2006版本更新 0 数据手册 (1) MRF6S19060NR1, MRF6S19060NBR1 1930-1990 MHz, 12 W Avg., 28 V, 2 x N-CDMA Lateral N-Channel RF Power MOSFETs[MRF6S19060N] PDFDec 27, 2010版本更新 5