PowerQUICC®处理器带CPM (1 SCC、2 SMC)、10/100以太网
封装/质量
质量信息
| 部分/封装 | 物质声明 | 安全保障/功能安全 | 湿度灵敏度等级(MSL) | Peak Package Body Temperature(PPT)(℃) | Maximum Time at Peak Temperature(s) | |||
|---|---|---|---|---|---|---|---|---|
| 铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | |||
| MPC855TZQ80D4 封装 : BGA357 |
MPC855TZQ80D4 (935316743557) |
No | 3 | - | 245 | - | 30 | - |
| MPC855TZQ66D4 封装 : BGA357 |
MPC855TZQ66D4 (935325295557) |
No | 3 | - | 245 | - | 30 | - |
| MPC855TZQ50D4 封装 : BGA357 |
MPC855TZQ50D4 (935309565557) |
No | 3 | - | 245 | - | 30 | - |
| MPC855TZQ50D4R2 (935309565518) |
No | 3 | - | 245 | - | 30 | - | |
| MPC855TVR80D4 封装 : BGA357 |
MPC855TVR80D4 (935319181557) |
No | - | 3 | - | 245 | - | 30 |
| MPC855TVR66D4 封装 : BGA357 |
MPC855TVR66D4 (935322728557) |
No | - | 3 | - | 245 | - | 30 |
| MPC855TVR50D4 封装 : BGA357 |
MPC855TVR50D4 (935309564557) |
No | - | 3 | - | 245 | - | 30 |
| MPC855TVR50D4R2 (935309564518) |
No | - | 3 | - | 245 | - | 30 | |
| MPC855TCZQ66D4 封装 : BGA357 |
MPC855TCZQ66D4 (935319179557) |
No | 3 | - | 245 | - | 30 | - |
| MPC855TCZQ50D4 封装 : BGA357 |
MPC855TCZQ50D4 (935325294557) |
No | 3 | - | 245 | - | 30 | - |
| MPC855TCVR66D4 封装 : BGA357 |
MPC855TCVR66D4 (935316742557) |
No | - | 3 | - | 245 | - | 30 |
| MPC855TCVR50D4 封装 : BGA357 |
MPC855TCVR50D4 (935325245557) |
No | - | 3 | - | 245 | - | 30 |