LPC810 and LPC830: 32-Bit Arm® Cortex®-M0+-Based Low-Cost MCU
封装/质量
质量信息
| 部分/封装 | 物质声明 | 安全保障/功能安全 | 湿度灵敏度等级(MSL) | Peak Package Body Temperature(PPT)(℃) | ||
|---|---|---|---|---|---|---|
| 铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | |||
| LPC834M101FHI33 封装 : HVQFN32 |
LPC834M101FHI33Y (935309056518) |
No | 3 | 3 | 240 | 260 |
| LPC832M101FDH20 封装 : TSSOP20 |
LPC832M101FDH20FP (935309057129) |
No | 1 | 1 | 240 | 260 |
| LPC812M101JTB16 封装 : XSON16 |
LPC812M101JTB16X (935301584115) |
No | 1 | 1 | 240 | 260 |
| LPC812M101JDH20 封装 : TSSOP20 |
LPC812M101JDH20FP (935302401129) |
No | 1 | 1 | 240 | 260 |
| LPC812M101JDH20J (935302401118) |
No | 1 | 1 | 240 | 260 | |
| LPC812M101JDH16 封装 : TSSOP16 |
LPC812M101JDH16FP (935302398129) |
No | 1 | 1 | 240 | 260 |
| LPC812M101JDH16J (935302398118) |
No | 1 | 1 | 240 | 260 | |
| LPC812M101JD20 封装 : SO20 |
LPC812M101JD20FP (935302399129) |
No | 1 | 1 | 240 | 260 |
| LPC812M101JD20J (935302399118) |
No | 1 | 1 | 240 | 260 | |
| LPC811M001JDH16 封装 : TSSOP16 |
LPC811M001JDH16FP (935302397129) |
No | 1 | 1 | 240 | 260 |
| LPC811M001JDH16J (935302397118) |
No | 1 | 1 | 240 | 260 | |
| LPC810M021FN8 封装 : DIP8 |
LPC810M021FN8FP (935299646129) |
No | - | - | - | - |