SVF532R2K1CMK4 产品信息|NXP

特点


VFxxx R Cortex- M4 Primary core, Cortex A5, L2 Cache, OpenVG GPU, 364 BGA package

封装


LFBGA364: LFBGA364, plastic, low profile fine-pitch ball grid array; 364 bumps; 0.8 mm pitch; 17 mm x 17 mm x 1.33 mm body

购买选项

SVF532R2K1CMK4

正常供应

12NC: 935320435557

详细信息

订购

从分销商处购买

SVF532R2K1CMK4R

正常供应

12NC: 935320435518

详细信息

订购

从分销商处购买

工作特点

参数
Operating Frequency [Max] (MHz)
400
Core Type
Arm Cortex-M4
Core: Number of cores (SPEC)
2
RAM (kB)
1000
UART
6
参数
CAN
2
DSPI
4
I2C
4
ESAI
1

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SVF532R2K1CMK4(935320435557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
1389.6
SVF532R2K1CMK4R(935320435518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
1389.6

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SVF532R2K1CMK4
(935320435557)
No
3
260
40
SVF532R2K1CMK4R
(935320435518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)CCATS
SVF532R2K1CMK4
(935320435557)
854231
5A992C
G173573
SVF532R2K1CMK4R
(935320435518)
854231
5A992C
G173573

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SVF532R2K1CMK4
(935320435557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SVF532R2K1CMK4R
(935320435518)
SVF532R2K1CMK4
(935320435557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SVF532R2K1CMK4R
(935320435518)
SVF532R2K1CMK4
(935320435557)
2018-02-152018-02-16201712016IVFxxx Controller (Vybrid) Datasheet Revision Update
SVF532R2K1CMK4R
(935320435518)
SVF532R2K1CMK4
(935320435557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
SVF532R2K1CMK4R
(935320435518)

更多信息 VF5xxR

The VFxxx VF5xxR family is purpose-built and cost-optimized for advanced connected radio, entry-level infotainment and digital instrument cluster applications. A dual-core (Arm® Cortex®-A5 + Cortex-M4) architecture handles both MCU and MPU tasks on a single chip. Generous 1.5 MB on-chip SRAM and multiple package options provide scalability from low-cost basic connected radios up to entry-level infotainment systems with dual displays and GPU-accelerated rich, compelling user interfaces.