SPC5744CBK1ACMH6 产品信息|NXP

SPC5744CBK1ACMH6

正常供应

SPC5744CBK1ACMH6

正常供应

封装


LBGA100: LBGA100, plastic, low profile ball grid array; 100 balls; 1 mm pitch; 11 mm x 11 mm x 1.27 mm body

购买选项

SPC5744CBK1ACMH6

正常供应

12NC: 935380842557

详细信息

订购

从分销商处购买

工作特点

无相关信息

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
SPC5744CBK1ACMH6(935380842557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
280.2

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5744CBK1ACMH6
(935380842557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)CCATS
SPC5744CBK1ACMH6
(935380842557)
854231
5A992C
G173419

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5744CBK1ACMH6
(935380842557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5744CBK1ACMH6
(935380842557)
2019-03-272019-04-28201901008IMPC5746C 100MAPBGA and 256MAPBGA Site Expansion: Burn-In from TTM to TTTJ and Final Test from NXP-ATKL to NXP-ATTJ
SPC5744CBK1ACMH6
(935380842557)
2019-02-012019-02-02201901025IMPC5748G and MPC5746C Reference Manual and Datasheet Update