MPC860PCZQ66D4 产品信息|NXP

特点


PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C

封装


BGA357: BGA357, plastic, ball grid array; 357 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.52 mm body

购买选项

工作特点

参数
External Memory Supported
EPROM, SDRAM, SRAM

环境

部件/12NC无铅欧盟 RoHSRHF指标二级互连REACH SVHC重量(mg)
MPC860PCZQ66D4(935325325557)
No
No
N
e0
REACH SVHC
2173.7

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
铅焊接铅焊接铅焊接
MPC860PCZQ66D4
(935325325557)
No
3
245
30

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MPC860PCZQ66D4
(935325325557)
854231
3A991A2

停产和更换部件数据

部件/12NC停产通知替代器件
MPC860PCZQ66D4
(935325325557)
-
MPC860PCVR66D4
(935309601557)

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC860PCZQ66D4
(935325325557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC860PCZQ66D4
(935325325557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 MPC860

The MPC860 PowerQUICC® offers an integrated processor and peripheral solution that can be used in a variety of communications and networking controller applications.

  • Delivers higher performance in all areas of device operation including flexibility, extensions in capability, and integration
  • Provides lower power consumption than traditional architectures
  • Backed by strong third-party tool support through Our Design Alliance Program