MPC850VR50BU 产品信息|NXP

MPC850VR50BU

使用寿命终止

MPC850VR50BU

使用寿命终止

特点


PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C

封装


BGA256: BGA256, plastic, ball grid array; 256 balls; 1.27 mm pitch; 23 mm x 23 mm x 2.54 mm body

购买选项

MPC850VR50BU

使用寿命终止

12NC: 935321153557

详细信息

订购

从分销商处购买

工作特点

参数
External Memory Supported
EPROM, SDRAM, SRAM

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MPC850VR50BU(935321153557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
1662.95

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MPC850VR50BU
(935321153557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MPC850VR50BU
(935321153557)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC850VR50BU
(935321153557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MPC850VR50BU
(935321153557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC850VR50BU
(935321153557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 MPC850

The MPC850 PowerQUICC® processor offers a versatile, integrated, low-cost solution for variety of controller, networking, and communications applications.

  • Includes extensive communications and system integration support
  • Simplifies development and accelerates time-to-market
  • Offloads core tasks for increased performance and efficiency
  • Backed by strong third-party tool support through Our Design Alliance Program