MPC555LFCVR40 产品信息|NXP

特点


MPC500 32-bit MCU, PowerPC core, 448KB Flash, 40MHz, PBGA 272

封装


BGA272: BGA272, plastic, ball grid array; 272 balls; 1.27 mm pitch; 27 mm x 27 mm x 1.95 mm body

购买选项

MPC555LFCVR40

使用寿命终止

12NC: 935313622557

详细信息

订购

工作特点

参数
Security Status
COMPANY PUBLIC
Description
MPC500 32-bit MCU, PowerPC core, 448KB Flash, 40MHz, PBGA 272
参数
Number of pins
272
Package Style
BGA

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MPC555LFCVR40(935313622557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
2545.2

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MPC555LFCVR40
(935313622557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MPC555LFCVR40
(935313622557)
854231
3A991A2

停产和更换部件数据

部件/12NC停产通知上次购买日期上次发货日期替代器件
MPC555LFCVR40
(935313622557)
NOTICE
2024-08-12
2025-08-12
-

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MPC555LFCVR40
(935313622557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MPC555LFCVR40
(935313622557)
2024-02-122024-02-13202402009DNMPC555 Product Discontinuance
MPC555LFCVR40
(935313622557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC555LFCVR40
(935313622557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 MPC555

The MPC555 MCU offers a high-speed solution designed for automotive applications such as engine and transmission control, as well as robotics and avionics control.

  • Accelerates advanced algorithms necessary to support complex applications
  • Includes high-performance data manipulation capabilities
  • Allows for flexibility to change or upgrade products late in the production cycle
  • Offers low development costs and quick time-to-market cycles