MKL27Z32VDA4 产品信息|NXP

特点


Kinetis L 32-bit MCU, ARM Cortex-M0+ Core, 32KB Flash, 48MHz, USB, XFBGA 36

封装


XFBGA36: XFBGA36, plastic, extremely thin fine-pitch ball grid array; 36 balls; 0.5 mm pitch; 3.5 mm x 3.5 mm x 0.43 mm body

购买选项

工作特点

参数
Core Type
Arm Cortex-M0+
Operating Frequency [Max] (MHz)
48
Flash (kB)
32
SRAM (kB)
8
Serial Communication
2 x I²C, 2 x I²C, 2 x SPI, 2 x SPI, 3 x UART, 3 x UART
USB Controllers
1
Security
CRC
参数
PWM [Number, bits]
10 x 16
ADC [Number, bits]
1 x 16
DAC [Number, bits]
1 x 6
GPIO
30
Supply Voltage [Min to Max] (V)
1.71 to 3.6
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MKL27Z32VDA4(935323774557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
10.9

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MKL27Z32VDA4
(935323774557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MKL27Z32VDA4
(935323774557)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MKL27Z32VDA4
(935323774557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MKL27Z32VDA4
(935323774557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MKL27Z32VDA4
(935323774557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 KL2x

The Kinetis® KL2x is an ultra-low-power MCU family that adds a full-speed USB 2.0 On-the-Go (OTG) controller or a full-speed crystal-less USB 2.0 device controller in addition to the Kinetis KL1x series.

The Kinetis KL2x MCU family is compatible with Kinetis K20 MCUs (based on Arm® Cortex®-M4), and with all other Kinetis KL1x, KL2x, KL3x, and KL4x series MCUs, providing a migration path to lower and higher performance and feature integration.