Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特点
Kinetis® K60-100 MHz, Mixed-Signal Integration Microcontrollers based on Arm® Cortex®-M4 Core
封装
LQFP100: LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body
购买选项
MK60DX256VLL10
正常供应
12NC: 935325655557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Core Type | Arm Cortex-M4 |
Operating Frequency [Max] (MHz) | 100 |
SRAM (kB) | 64 |
Flash (kB) | 512 |
EEPROM (kB) | 0.004 |
UART | 5 |
SPI | 3 |
I2C | 2 |
USB Controllers | 1 |
| 参数 | 值 |
|---|---|
CAN | 2 |
GPIO | 66 |
ADC (16 bit) | 2 |
16-bit PWM | 12 |
Security | CA, CRC, RNG |
Supply Voltage [min] (V) | 1.71 |
Supply Voltage [max] (V) | 3.6 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MK60DX256VLL10(935325655557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 685.2 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MK60DX256VLL10 (935325655557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) | 脚印 | OrCAD Capture符号 |
|---|---|---|---|---|
MK60DX256VLL10 (935325655557) | 854231 | 3A991A2 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MK60DX256VLL10 (935325655557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MK60DX256VLL10 (935325655557) | 2020-10-30 | 2020-11-30 | 202007015I | NXP Standardized Tray Attributes for LQFP 14x14 Bulk Shipments |
更多信息 K60_100
The Kinetis® K60 100 MHz IEEE® 1588 Ethernet MCUs are built on the Arm® Cortex®-M4 core and feature advanced analog integration and serial communication. Available down to a 5 mm x 5 mm wafer-level chip-scale package (WLCSP), these devices maximize board space and enhance performance with minimum-length interconnections, allowing the miniaturization of existing applications. This family shares the comprehensive enablement and scalability of the Kinetis portfolio.