MCIMX6Y2DVM09AB 产品信息|NXP

MCIMX6Y2DVM09AB

正常供应

MCIMX6Y2DVM09AB

正常供应

特点


i.MX 6ULL Single-Core Processor with Arm® Cortex®-A7 Core

封装


LFBGA289: LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.18 mm body

购买选项

MCIMX6Y2DVM09AB

正常供应

12NC: 935357252557

详细信息

数量

单价

1 - 25$8.84
26 - 99$8.16
100+$7.48

订购

$8.84 USD
现货:992
从分销商处购买

工作特点

参数
Core: Number of cores (SPEC)
1
Core Type
Arm Cortex-A7
Operating Frequency [Max] (MHz)
900
External Memory Supported
DDR3 SDRAM, DDR3L SDRAM, LPDDR2 DRAM
Video/Display features
PCP
L2 Cache (Max) (KB)
128
SRAM (kB)
128
参数
SPI
4
I2C
4
UART
8
USB Controllers
2
Junction Temperature (Min) (℃)
0
Junction Temperature (Max) (℃)
95

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
MCIMX6Y2DVM09AB(935357252557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
451.4

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MCIMX6Y2DVM09AB
(935357252557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)CCATS
MCIMX6Y2DVM09AB
(935357252557)
854231
5A992C
G163970

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MCIMX6Y2DVM09AB
(935357252557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MCIMX6Y2DVM09AB
(935357252557)
2020-08-162020-08-17202005018IChip Errata Update for i.MX6UL&i.MX6SLL&i.MX6ULZ&i.MX6ULL
MCIMX6Y2DVM09AB
(935357252557)
2019-08-162019-11-13201907020F01i.MX6ULL Fab Site Transfer from SMIC8 to SMICB2
MCIMX6Y2DVM09AB
(935357252557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

更多信息 i.MX6ULL

The i.MX 6ULL is a power efficient and cost-optimized applications processor family featuring an advanced implementation of a single Arm Cortex-A7 core, which operates at speeds up to 900 MHz. The i.MX 6ULL applications processor includes an integrated power management module that reduces the complexity of an external power supply and simplifies power sequencing. Each processor in this family provides various memory interfaces, including 16-bit LPDDR2, DDR3, DDR3L, raw and managed NAND flash, NOR flash, eMMC, Quad SPI and a wide range of other interfaces for connecting peripherals such as WLAN, Bluetooth®, GPS, displays and camera sensors.