MCIMX6X4CVM08AC 产品信息|NXP

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技术

MCIMX6X4CVM08AC

正常供应

MCIMX6X4CVM08AC

正常供应
LFBGA529, plastic, low profile fine-pitch ball grid array; 529 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.37 mm body
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特点

i.MX 6SoloX Processors - Heterogeneous Processing with Arm® Cortex®-A9 and Cortex-M4 Cores

  • 数据手册:
  • PDF

封装

LFBGA529: LFBGA529, plastic, low profile fine-pitch ball grid array; 529 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.37 mm body

购买选项

MCIMX6X4CVM08AC

正常供应

12NC: 935354439557

详细信息

  • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小封装数量: 84
  • 起订量: 420
  • 交付周期: 13 weeks
  • 预算报价（不含税）: 1K 在 US$19.81 USD

数量

单价

1 - 25$25.75
26 - 99$23.77
100+$21.79

订购

$25.75 USD
现货:743

Normally ships in 1-2 business days.

加入购物车免费样品
从分销商处购买

工作特点

参数值
Core: Number of cores (SPEC)
1
Core Type
Arm Cortex-A9
Operating Frequency [Max] (MHz)
800
External Memory Supported
DDR3 SDRAM, DDR3L SDRAM, ECC, LPDDR2 DRAM, NAND FLASH, NOR FLASH, ONFI2.2, QSPI
Video/Display features
PCP, VADC
PCIe
1 x PCIe 2.0
L2 Cache (Max) (KB)
256
SRAM (kB)
128
参数值
SPI
5
I2C
4
UART
6
USB Controllers
3
Junction Temperature (Min) (℃)
-40
Junction Temperature (Max) (℃)
105
Audio Specific Modules
AA, ESAI
GPU 2D / GPU 3D
Vivante GC300 (300Mpx/s), Vivante GC400T (17Mtri/s)

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量（mg）
MCIMX6X4CVM08AC(935354439557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
936.7

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MCIMX6X4CVM08AC
(935354439557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MCIMX6X4CVM08AC
(935354439557)
854231
5A992C

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MCIMX6X4CVM08AC
(935354439557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MCIMX6X4CVM08AC
(935354439557)
2019-07-142019-07-15201805041IU01iMX6DQ+ iMX6DQ iMX6SDL iMX6SL iMX6SX Reference Manual Updates

更多信息 i.MX6SX

As the first device utilizing both the Arm® Cortex®-A9 and Cortex-M4 cores, the i.MX 6SoloX applications processor offers a highly integrated multi-market solution.

  • Enables secure, connected homes and vehicles within the Internet of Things (IoT)
  • Delivers secure and robust implementation to enable concurrent execution of multiple software environments
  • Provides for an application-rich system with real-time responsiveness
  • Maintains maximum effectiveness and security when portioning system resources such as memory and peripherals
  • Backed by a strong enablement ecosystem for better customer solutions and faster time-to-market

The i.MX 6SoloX is supported by companion power management ICs (PMIC) MMPF0100 and MMPF0200.

i.MX 6 applications processors are part of NXP's EdgeVerse™ edge computing platform.

更多