MCIMX535DVP1C2 产品信息|NXP

MCIMX535DVP1C2

不推荐用于新设计

MCIMX535DVP1C2

不推荐用于新设计

特点


Multimedia Applications Processors - HD Video, High-End, Advanced Applications, Arm® Cortex®-A8 Core

封装


FBGA529: FBGA529, fine pitch ball grid array package, 529 terminals, 0.8 mm pitch, 19 mm x 19 mm x 1.64 mm body

购买选项

MCIMX535DVP1C2

不推荐用于新设计

12NC: 935420971557

详细信息

订购

从分销商处购买

MCIMX535DVP1C2R2

不推荐用于新设计

12NC: 935420971518

详细信息

订购

从分销商处购买

工作特点

参数
Number of pins
529
Package Style
FBGA

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
MCIMX535DVP1C2(935420971557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
2136.1
MCIMX535DVP1C2R2(935420971518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
2136.1

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MCIMX535DVP1C2
(935420971557)
No
3
260
40
MCIMX535DVP1C2R2
(935420971518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)CCATS
MCIMX535DVP1C2
(935420971557)
854231
5A992C
G166378
MCIMX535DVP1C2R2
(935420971518)
854231
5A992C
G166378

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MCIMX535DVP1C2
(935420971557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MCIMX535DVP1C2R2
(935420971518)

更多信息 i.MX537

The i.MX53 family of processors represents NXP’s next generation of advanced multimedia and power-efficient implementation of the Arm® Cortex®-A8 core. With core processing speeds up to 800 MHz, the i.MX537 is optimized for both performance and power to meet the demands of high-end, advanced applications. Integrated display controller, 1080p HD video decode and 720p video encode, enhanced graphics and connectivity features make the i.MX537 ideal for a wide range of applications such as Human Machine Interfaces (HMI) and patient monitors which require rich user interfaces with high color displays and user interaction.

The i.MX537 provides key environmental differentiators for the industrial market. These include 3.3V I/O support, a 0.8 mm pitch package to reduce PCB and manufacturing costs, extended temperature coverage for harsh environments, industrial qualification for extended reliability and a formal long product supply guarantee to support product life spans.

The i.MX537 is supported by a companion NXP power management IC (PMIC), MC34709.

更多