Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
封装
LFBGA400: LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.18 mm body
购买选项
MCIMX356AVM4B
正常供应
12NC: 935310426557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Core Type | 1 x Arm11 |
Operating Frequency [Max] (MHz) | 400 |
L2 Cache (Max) (KB) | 128 |
Serial Communication | 3 x I²C, 3 x UART |
| 参数 | 值 |
|---|---|
CAN | 1 |
Ethernet | 1 x 10/100 BaseT |
PWM [Number, bits] | 1 x 16 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MCIMX356AVM4B(935310426557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 838.7 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MCIMX356AVM4B (935310426557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) | CCATS |
|---|---|---|---|
MCIMX356AVM4B (935310426557) | 854231 | 5A992C | G167044 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MCIMX356AVM4B (935310426557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MCIMX356AVM4B (935310426557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
更多信息 i.MX356
The i.MX356 provides all of the functionality required in today’s automotive market. With an Arm11™ core running at 532 MHz the i.MX356 integrates an OpenVG™ 1.1 vector graphics hardware accelerator. The OpenVG was integrated to deliver smooth textural visuals required in today’s automotive infotainment systems. The processor features an advanced Image Processing Unit (IPU) with updated resizing capabilities to handle wide-VGA and increased the interface to 24-bit for higher color display capabilities. To reduce BOM cost flexible connectivity options were integrated, such as 2-CAN modules, Media Local Bus (MLB), Enhanced Serial Audio Interface (ESAI), Ethernet, and two USB ports with integrated PHYs. The i.MX356 can connect too many different peripherals like Wi-Fi via SDIO or USB, Bluetooth via UART or SSI/I2S and external storage via CE-ATA or PATA. Support for lower cost memories like 3.3V SDRAM, DDR2, and multi-level cell NAND were integrated.
The i.MX356 is supported by companion NXP® power management ICs (PMIC), MC13892 and MMPF0100.