Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
LFBGA400: LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.18 mm body
12NC: 935319631557
详细信息
订购
参数 | 值 |
---|---|
Core Type | 1 x Arm11 |
Operating Frequency [Max] (MHz) | 400 |
L2 Cache (Max) (KB) | 128 |
Serial Communication | 2 x SPI, 3 x I²C |
参数 | 值 |
---|---|
CAN | 2 |
Ethernet | 1 x 10/100 BaseT |
PWM [Number, bits] | 1 x 16 |
部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量(mg) |
---|---|---|---|---|---|---|---|
MCIMX355AVM4B(935319631557) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e1 | REACH SVHC | 838.7 |
部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度(PPT)(C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MCIMX355AVM4B (935319631557) | No | 3 | 260 | 40 |
部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) | CCATS |
---|---|---|---|
MCIMX355AVM4B (935319631557) | 854231 | 5A992C | G167044 |
部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
---|---|---|---|---|
MCIMX355AVM4B (935319631557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCIMX355AVM4B (935319631557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
The i.MX355 processor takes advantage of the Arm11™ core running at 532 MHz with the advantage of an Image Processing Unit. The i.MX355 integrates Enhanced Serial Audio Interface (or ESAI) for multi-channel (5.1) audio, SPDIF I/O for compressed digital audio connectivity and an advanced sample rate converter (ASRC) for mixing digital content with different sampling frequencies. For flexible connectivity options the i.MX355 integrates 2-CAN modules, Media Local Bus (or MLB), Ethernet and the ability to connect to external wireless modules via SDIO or USB ports. To reduce system costs a full-speed PHY on the Host port and high-speed PHY on the On-the-go port were added. Support for lower cost memories like 3.3V SDRAM, DDR2, and multi-level cell NAND were integrated. Also included are storage device connections P-ATA and CE-ATA.
The i.MX355 is supported by companion NXP® power management ICs (PMIC), MC13892 and MMPF0100.