Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
封装
LFBGA400: LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.18 mm body
购买选项
MCIMX353DVM5B
正常供应
12NC: 935314056557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Core Type | 1 x Arm11 |
Operating Frequency [Max] (MHz) | 532 |
L2 Cache (Max) (KB) | 128 |
Serial Communication | 3 x I²C, 3 x UART |
| 参数 | 值 |
|---|---|
CAN | 1 |
Ethernet | 1 x 10/100 BaseT |
PWM [Number, bits] | 1 x 16 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MCIMX353DVM5B(935314056557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 838.7 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MCIMX353DVM5B (935314056557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) | CCATS |
|---|---|---|---|
MCIMX353DVM5B (935314056557) | 854231 | 5A992C | G167044 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MCIMX353DVM5B (935314056557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MCIMX353DVM5B (935314056557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCIMX353DVM5B (935314056557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
更多信息 i.MX353
NXP’s Arm11™-based i.MX353 multimedia applications processors is targeted for consumer and industrial applications. To reduce the BOM costs it is packed with connectivity options including UARTs, SPIs, Ethernet, two Controller Area, Network (CAN) modules, two USB ports with integrated PHYs, ESAI and three MMC/SD/SDIO ports. The i.MX353 has the ability to connect to external wireless modules via a USB or SDIO port and supports external storage via CE-ATA or PATA. Support for cost-effective memory options like DDR2 and multi-level cell NAND reduce system costs and provide the design engineer great flexibility.
The i.MX353 is supported by companion NXP power management ICs (PMIC), MC13892 and MMPF0100.