MCIMX233CJM4C 产品信息|NXP

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工业

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技术

MCIMX233CJM4C

正常供应

MCIMX233CJM4C

正常供应

特点

Huashan TA5 ROM 169BGA - Industrial

  • 数据手册:
  • PDF

封装

LFBGA169: LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.8 mm pitch; 11 mm x 11 mm x 1.02 mm body

购买选项

MCIMX233CJM4C

正常供应

12NC: 935314408557

详细信息

  • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
  • 最小封装数量: 176
  • 起订量: 880
  • 交付周期: 13 weeks
  • 预算报价（不含税）: 1K 在 US$10.39 USD

订购

从分销商处购买

MCIMX233CJM4CR2

正常供应

12NC: 935314408518

详细信息

  • 包装: REEL-Reel 13" Q1/T1 in Drypack
  • 最小封装数量: 1500
  • 起订量: 1500
  • 交付周期: 13 weeks
  • 预算报价（不含税）: 1K 在 US$10.39 USD

订购

从分销商处购买

工作特点

参数值
Core Type
1 x Arm9
Operating Frequency [Max] (MHz)
454
Serial Communication
1 x I²C, 1 x SPI, 3 x UART

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量（mg）
MCIMX233CJM4C(935314408557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
280.4
MCIMX233CJM4CR2(935314408518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
280.4

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MCIMX233CJM4C
(935314408557)
No
3
260
40
MCIMX233CJM4CR2
(935314408518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MCIMX233CJM4C
(935314408557)
854231
5A992C
MCIMX233CJM4CR2
(935314408518)
854231
5A992C

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MCIMX233CJM4C
(935314408557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MCIMX233CJM4CR2
(935314408518)

更多信息 i.MX233

The i.MX233 applications processor provides ample headroom for consumer and embedded applications without sacrificing battery life.

  • Allows customers to eliminate external components, reducing overall system bill of materials cost
  • Integrates advanced power management technology to manage the power sequencing required by the processor itself
  • Offers low power consumption that can improve energy efficiency
  • Backed by strong enablement for designing differentiated products in less time