MC35XS3500PNA 产品信息|NXP

特点


PENTA 35MOHM ESWITCH

    封装


    HWFLGA36: HWFLGA36, plastic thermal enhanced very very thin fine-pitch land grid array package, 0.4 mm pitch, 2.1 mm x 6 mm x 0.637 mm body

    购买选项

    MC35XS3500PNA

    停产

    12NC: 934070567557

    详细信息

    订购

    MC35XS3500PNAR2

    停产

    12NC: 934070567528

    详细信息

    订购

    工作特点

    无相关信息

    环境

    部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
    MC35XS3500PNA(934070567557)
    No
    Yes
    Yes
    H
    e4
    REACH SVHC
    937.7
    MC35XS3500PNAR2(934070567528)
    No
    Yes
    Yes
    H
    e4
    REACH SVHC
    937.7

    质量

    部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
    无铅焊接无铅焊接无铅焊接
    MC35XS3500PNA
    (934070567557)
    No
    3
    260
    40
    MC35XS3500PNAR2
    (934070567528)
    No
    3
    260
    40

    配送

    部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
    MC35XS3500PNA
    (934070567557)
    854239
    EAR99
    MC35XS3500PNAR2
    (934070567528)
    854239
    EAR99

    停产和更换部件数据

    部件/12NC停产通知上次购买日期上次发货日期替代器件
    MC35XS3500PNA
    (934070567557)
    -
    2011-01-15
    2012-05-31
    MC35XS3500HFK
    (934070571557)
    MC35XS3500PNAR2
    (934070567528)
    -
    2011-01-15
    2012-05-31
    MC35XS3500HFKR2
    (934070571528)

    产品变更通知

    部件/12NC发行日期生效日期产品更改通知标题
    MC35XS3500PNA
    (934070567557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
    MC35XS3500PNAR2
    (934070567528)