MC33879BPEK 产品信息|NXP

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工业

消费电子

技术

MC33879BPEK

正常供应

MC33879BPEK

正常供应
HSOP32, plastic, heatsink, small outline leaded package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.2 mm body
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特点

Switch, Congifurable 8 Channels, SOIC 32

  • 数据手册:
  • PDF

封装

HSOP32: HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.22 mm body

购买选项

MC33879BPEK

正常供应

12NC: 935432238574

详细信息

  • 包装: TUBE-Tube in Drypack
  • 最小封装数量: 42
  • 起订量: 42
  • 交付周期: 16 weeks
  • 预算报价（不含税）: 1K 在 US$2.19 USD

订购

从分销商处购买

MC33879BPEKR2

正常供应

12NC: 935432238518

详细信息

  • 包装: REEL-Reel 13" Q1/T1 in Drypack
  • 最小封装数量: 1000
  • 起订量: 1000
  • 交付周期: 16 weeks
  • 预算报价（不含税）: 1K 在 US$2.19 USD

订购

从分销商处购买

工作特点

参数值
Output Current (A)
0.6 to 1.2
Supply Voltage [Min to Max] (V)
5.5 to 27.5
Operating Temperature (Min-Max) (℃)
-40 to 125

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量（mg）
MC33879BPEK(935432238574)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
500.9
MC33879BPEKR2(935432238518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
500.9

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MC33879BPEK
(935432238574)
No
3
260
40
MC33879BPEKR2
(935432238518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MC33879BPEK
(935432238574)
854239
EAR99
MC33879BPEKR2
(935432238518)
854239
EAR99

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MC33879BPEK
(935432238574)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC33879BPEKR2
(935432238518)

更多信息 MC33879

The NXP® MC33879 device is an 8-output hardware configurable, high side/low side switch with 16-bit serial input control using the serial peripheral interface (SPI).

  • Two of the outputs may be controlled directly via a MCU for pulse-width modulation applications
  • Incorporates SMARTMOS® technology with CMOS logic, bipolar/MOS analog circuitry, and DMOS power MOSFETs
  • Controls various inductive, incandescent, or LED loads by directly interfacing with a MCU
  • We recommend the use of the "B" version devices for new designs