MC10XS3425EK 产品信息|NXP

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MC10XS3425EK

使用寿命终止

MC10XS3425EK

使用寿命终止
sot1746-2_3d
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特点

High-Side Switch, 12V, Dual 10mOhms + Dual 25mOhms, SOICEP 32

  • 数据手册:
  • PDF

封装

HSOP32: plastic, heatsink small outline package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.3 mm body

购买选项

MC10XS3425EK

使用寿命终止

12NC: 934070612574

详细信息

  • 包装: TUBE-Tube in Drypack
  • 最小封装数量: 42
  • 起订量: 42
  • 交付周期: 99 weeks
  • 预算报价（不含税）: 1K 在 US$2.70 USD

订购

从分销商处购买

MC10XS3425EKR2

使用寿命终止

12NC: 934070612518

详细信息

  • 包装: REEL-Reel 13" Q1/T1 in Drypack
  • 最小封装数量: 1000
  • 起订量: 1000
  • 交付周期: 99 weeks
  • 预算报价（不含税）: 1K 在 US$2.70 USD

订购

工作特点

参数值
Number of pins
32
Package Style
HSOP
Host interface protocol
Output Current Limit Selectabl, PWM Capable, Sleep Mode
SPI [bits]
16
Additional Features
Output Current Limit Selectabl, PWM Capable, Sleep Mode
RDSon [typ]
0.01, 0.025
Device Function
high side switch
Protection & Diagnosis
overcurrent, overtemperature, short-circuit
Additional Features - Power Management
Output Current Limit Selectabl, PWM Capable, Sleep Mode
Function
SPI
Memory Protection
Output Current Limit Selectabl, PWM Capable, Sleep Mode
Security Status
COMPANY PUBLIC
Supply Voltage2 [Min to Max] (V)
6 to 20
Interface and Input Control
Direct from input / Direct from input, SPI / SPI
Protection
overcurrent, overtemperature, short-circuit
Description
High-Side Switch, 12V, Dual 10mOhms + Dual 25mOhms, SOICEP 32
Interface and Input Control
Direct from input, SPI
Supply Voltage [Min - Max]
3, 5.5
Additional Features - Security
SPI
Memory / Peripheral Protection
Output Current Limit Selectabl, PWM Capable, Sleep Mode
参数值
Diagnostics
Direct from input, SPI
Operating Voltage [Min to Max] (V)
3 to 5.5
Load Current (IL) [MAX] (A)
9, 19
Supply Voltage [max] (V)
5.5
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Supply Voltage [min] (V)
3
Low Power Modes
Output Current Limit Selectabl, PWM Capable, Sleep Mode
Pad supply (V)
3 to 5.5
Supply Voltage [Min to Max] (V)
3 to 5.5
Load Current (IL) [TYP] (A)
3, 6
Drain-to-Source On Resistance (Typ) (mOhm) (RDS(ON))
10, 25
Host Interface
Direct from input, SPI
Number of Channels
2, 2
Current Limit per Output (Min) (A) (ILIM)
63, 126
Load Supply Voltage (Min) (V)
6
Operating Temperature (Min-Max) (℃)
-40 to 125
Load Supply Voltage (Max) (V)
20
Security Features
Output Current Limit Selectabl, PWM Capable, Sleep Mode
Additional Features - Analog
Output Current Limit Selectabl, PWM Capable, Sleep Mode

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量（mg）
MC10XS3425EK(934070612574)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
482.8
MC10XS3425EKR2(934070612518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
482.8

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
MC10XS3425EK
(934070612574)
No
3
260
40
MC10XS3425EKR2
(934070612518)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
MC10XS3425EK
(934070612574)
854239
EAR99
MC10XS3425EKR2
(934070612518)
854239
EAR99

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
MC10XS3425EK
(934070612574)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC10XS3425EKR2
(934070612518)
MC10XS3425EK
(934070612574)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC10XS3425EKR2
(934070612518)
MC10XS3425EK
(934070612574)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MC10XS3425EKR2
(934070612518)

更多信息 MC12XS3

The NXP 12XS3 eXtreme Switch Generation 3 12 V devices are SPI-controlled smart high side switches providing diagnostics for the switch, light source and wiring harness, as well as comprehensive fault management and control of the loads without complex software.

  • Programmable multi-step latched overcurrent shutdown protection
  • Minimizes the thermal stress within the device during an overload condition, reducing the junction temperature rise and improving reliability
  • Packaged in a PQFN package and a SOICW-EP package
  • Low RDS(ON) and large integration enable savings in module size, power dissipation and total system cost