LPC804HI33 产品信息|NXP

封装


HVQFN32: HVQFN32, plastic thermal enhanced very thin quad flat package; no leads; 32 terminals, 0.5 mm pitch, 5 mm x 5 mm x 0.85 mm body

购买选项

工作特点

无相关信息

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
LPC804HI33/CP3368Y(935377179518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
69.940456

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)
铅焊接无铅焊接铅焊接无铅焊接
LPC804HI33/CP3368Y
(935377179518)
No
3
3
240
260

配送

部件/12NC协调关税 (美国)免责声明
LPC804HI33/CP3368Y
(935377179518)
854231

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
LPC804HI33/CP3368Y
(935377179518)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label