Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
SOT1261: plastic, thermal enhanced super thin quad flat package; no leads; 12 terminals; body 2.0 x 2.0 x 0.3 mm
12NC: 934068936115
详细信息
订购
参数 | 值 |
---|---|
Number of pins | 12 |
Package Style | HXQFN |
Product Application | 200/8 |
Pi(1dB) [typ] (dBm) | 7 |
Security Status | COMPANY PUBLIC |
Application | 200/8 |
Target Applications | 200/8 |
Supply Current (TYP) (mA) | 8, 8.3 |
Icc, gain (mA) (typ) | 8.3 |
Description | WLAN LNA + switch |
Icc, bypass (uA) (typ) | 8 |
Noise Figure (Typ) (dB) | 2 |
Programming Voltage (TYP) (V) | 200/8 |
Input 3rd Order Intercept (dBm) | 7 |
参数 | 值 |
---|---|
Gain bypass (dB) (Typ) | -6 |
Supply Current (Typ) (μA) | 8000, 8300 |
NF (dB) | 2.0 |
IP3i (dBm) | 7.0 |
NF @Gp= 5 dB (dB) | 2 |
NF [typ] (dB) | 2 |
ICC [typ] (mA) | 8.3 |
Icc, TX/BT (dB) (Typ) | 200/8 |
Gass (dB) | 16 |
Gconv [typ] (dB) | 16 |
High Current GPIOS / EVDD | 200/8 |
Type Classification | 200/8 |
NXP_Gp [typ] (dB) | 16 |
Input 3rd Order Intercept (dBm) | 7 |
部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | REACH SVHC | 重量(mg) |
---|---|---|---|---|---|---|
BGS8324X(934068936115) | Yes | Yes | Yes | REACH SVHC | 0.0 |
部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度(PPT)(C°) | ||
---|---|---|---|---|---|
铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | ||
BGS8324X (934068936115) | - | tbf | tbf | 240 | 260 |
部件/12NC | 协调关税 (美国)免责声明 |
---|---|
BGS8324X (934068936115) | 854239 |
The BGS8324 is, also known as the WLAN3001H, a fully integrated Low-Noise Amplifier (LNA) and SP3T switch for Bluetooth path and transmit path. For WLAN applications in the 2.4 GHz to 2.5 GHz ISM band. The BGS8324 is manufactured using NXPs high performance QUBiC eighth generation SiGe:C technology. The BGS8324 couples noise figure, linearity and low insertion loss CMOS switches with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGS8324 has a 2.0 mm × 2.0 mm footprint HX2QFN12 package and a thickness of 300 μm.