BGS8324 产品信息|NXP

购买选项

BGS8324X

停产

12NC: 934068936115

详细信息

订购

工作特点

参数
Number of pins
12
Package Style
HXQFN
Product Application
200/8
Pi(1dB) [typ] (dBm)
7
Security Status
COMPANY PUBLIC
Application
200/8
Target Applications
200/8
Supply Current (TYP) (mA)
8, 8.3
Icc, gain (mA) (typ)
8.3
Description
WLAN LNA + switch
Icc, bypass (uA) (typ)
8
Noise Figure (Typ) (dB)
2
Programming Voltage (TYP) (V)
200/8
Input 3rd Order Intercept (dBm)
7
参数
Gain bypass (dB) (Typ)
-6
Supply Current (Typ) (μA)
8000, 8300
NF (dB)
2.0
IP3i (dBm)
7.0
NF @Gp= 5 dB (dB)
2
NF [typ] (dB)
2
ICC [typ] (mA)
8.3
Icc, TX/BT (dB) (Typ)
200/8
Gass (dB)
16
Gconv [typ] (dB)
16
High Current GPIOS / EVDD
200/8
Type Classification
200/8
NXP_Gp [typ] (dB)
16
Input 3rd Order Intercept (dBm)
7

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
BGS8324X(934068936115)
Yes
Yes
Yes
DREACH SVHC
0.0

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)
铅焊接无铅焊接铅焊接无铅焊接
BGS8324X
(934068936115)
-
tbf
tbf
240
260

配送

部件/12NC协调关税 (美国)免责声明
BGS8324X
(934068936115)
854239

更多信息 BGS8324

The BGS8324 is, also known as the WLAN3001H, a fully integrated Low-Noise Amplifier (LNA) and SP3T switch for Bluetooth path and transmit path. For WLAN applications in the 2.4 GHz to 2.5 GHz ISM band. The BGS8324 is manufactured using NXPs high performance QUBiC eighth generation SiGe:C technology. The BGS8324 couples noise figure, linearity and low insertion loss CMOS switches with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGS8324 has a 2.0 mm × 2.0 mm footprint HX2QFN12 package and a thickness of 300 μm.