查找外形尺寸、相关产品、焊接信息和热条件。
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请注意：本工具不包含新并入的恩智浦封装和封装数据
| Package Version | Package Name | 封装说明 | Reference Codes | 发行日期 |
|---|---|---|---|---|
| SOT1359-1 | HVFLGA | Plastic thermal enhanced very thin profile fine pitch land grid array package; 36 terminals, 0.4 mm pitch, 5 mm x 5 mm x 0.72 mm body | 2015-01-27 | |
| SOT1431-1 | HVFLGA44 | Plastic, thermal enhanced very thin profile fine pitch land grid array package; 44 terminals, 0.4 mm pitch, 5 mm x 5 mm x 0.72 mm body | 2016-08-12 |