SOT974-2: DFN3314-16 | 恩智浦半导体

SOT974-2: DFN3314-16


概述

plastic, thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
DFN3314-16 surface mount double HXSON 3.3 x 1.35 x 0.5 16 plastic
生产代码 Reference Codes Issue Date
SOT974 2010-03-25