SOT873-1: DFN3333-8 | 恩智浦半导体

SOT873-1: DFN3333-8


概述

plastic, thermal enhanced very thin small outline package; 8 terminals; 0.65 mm pitch; 3.3 mm x 3.3 mm x 1 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
DFN3333-8 surface mount double HVSON 3.3 x 3.3 x 1 8 plastic
生产代码 Reference Codes Issue Date
SOT873 2010-04-19