SOT795-1: BGA456


概述

plastic ball grid array package; 456 balls
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
BGA456 surface mount bottom BGA 27 x 27 x 2.25 456 plastic
生产代码 Reference Codes Issue Date
SOT795 MS-034(JEDEC);144E(IEC 2008-06-09
部分 描述 Quick access
Connected media processor
Connected media processor
Connected media processor
Connected media processor