SOT766-2: HLQFP176 | 恩智浦半导体

SOT766-2: HLQFP176


概述

Plastic thermal enhanced low profile quad flat package; 176 leads, 0.5 mm pitch, 24 mm x 24 mm x 1.4 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
HLQFP176 surface mount quad HLQFP 24 x 24 x 1.4 176 plastic
生产代码 Reference Codes Issue Date
SOT766 MS-026(JEDEC 2014-04-01