SOT740-2: LBGA256


概述

plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
LBGA256 surface mount bottom LBGA 17 x 17 x 1.45 256 plastic
生产代码 Reference Codes Issue Date
SOT740 MO-192(JEDEC 2005-08-04
部分 描述 Quick access
1 MB flash, 136 kB SRAM, two High-speed USB, Ethernet, LCD, LBGA256 package
Quad SPI Flash Interface (SPIFI), 200 kB SRAM, two High-speed USB, Ethernet, LCD, LBGA256 package
High Performance 32-bit Microcontroller based on ARM Cortex-M3
High Performance 32-bit Microcontroller based on ARM Cortex-M3
32-bit ARM Cortex-M3 MCU; 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC, AES engine
High Performance 32-bit Microcontroller (MCU) based on ARM Cortex-M3 Core
High Performance 32-bit Microcontroller (MCU) based on ARM Cortex-M3 Core
High Performance 32-bit Microcontroller based on ARM Cortex-M3
High Performance 32-bit Microcontroller (MCU) based on ARM Cortex-M3 Core
32-bit ARM Cortex-M3 flashless MCU with security features; 200 kB SRAM; Ethernet, two HS USB, EMC
High Performance 32-bit Microcontroller based on ARM Cortex-M4/M0
32-bit ARM Cortex-M3 flashless MCU with security features; 200 kB SRAM; Ethernet, two HS USB, LCD, EMC
High Performance 32-bit Microcontroller based on ARM Cortex-M3
High Performance 32-bit Microcontroller based on ARM Cortex-M3
High Performance 32-bit Microcontroller based on ARM Cortex-M3