SOT638-6: HTQFP100 | 恩智浦半导体

SOT638-6: HTQFP100


概述

plastic thermal enhanced thin quad flat package; 100 leads; exposed diepad, 0.5 mm pitch, 14 mm x 14 mm x 1 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
HTQFP100 surface mount quad HTQFP 14 x 14 x 1 100 plastic
生产代码 Reference Codes Issue Date
SOT638 2009-09-01