SOT638-5: HTQFP100 | 恩智浦半导体

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SOT638-5: HTQFP100

概述

plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT638-5	HTQFP100	surface mount	quad	HTQFP		100	plastic

生产代码	Reference Codes	Issue Date
SOT638	MS-026(JEDEC	2008-11-12