SOT633-3: HTSSOP38 | 恩智浦半导体

SOT633-3: HTSSOP38


概述

plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
HTSSOP38 surface mount double HTSSOP 38 plastic
生产代码 Reference Codes Issue Date
SOT633 2004-01-22