SOT618-13(DD): HVQFN40


概述

HVQFN40, plastic thermal enhanced very thin quad flat package; no leads, wettable flanks; 40 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
HVQFN40 surface mount quad HVQFN 6 x 6 x 0.85 40 plastic
生产代码 Reference Codes Issue Date
98ASA01025D 2018-11-13
部分 描述 Quick access
Secure and Ultra-Low-Power MCU for Zigbee, Thread and Bluetooth LE
Secure and Ultra-Low-Power MCU for Zigbee, Thread and Bluetooth LE
Kinetis W 32-bit MCU, Arm Cortex-M0+, 512KB Flash, 64KB SRAM, 48MHz, BLE, 40QFN